M7A3P1000-FGG484

The M7A3P1000-FGG484 is a ProASIC3 field-programmable gate array (FPGA) from Microchip Technology offering 1,000,000 gates and 24,576 logic elements in a compact BGA package. It provides on-chip embedded memory, abundant I/O, and a single-core programmable fabric suitable for commercial electronic designs that require flexible, reconfigurable logic.

With a 484-ball FPBGA (23×23) package and a defined operating range, this device is aimed at applications that need moderate logic density, significant I/O count, and controlled supply and temperature conditions.

Key Features

• Logic Capacity — 24,576 logic elements (LEs) providing a programmable fabric sized for mid-range logic integration and custom digital functions.
• Gate Count — 1,000,000 gates to map complex combinational and sequential logic structures.
• Embedded Memory — Approximately 0.15 Mbits of on-chip RAM (147,456 total RAM bits) for buffering, small FIFOs, and local data storage.
• I/O Count — 300 user I/O pins to support multi-channel interfaces, parallel buses, and extensive peripheral connectivity.
• Power — Defined core supply range of 1.425 V to 1.575 V to match platform power-rail requirements.
• Package and Mounting — 484-ball FPBGA (23×23) package in a surface-mount form factor for compact PCB integration.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard commercial deployments.
• Compliance — RoHS-compliant material construction.

Typical Applications

• General-purpose programmable logic — Implement custom glue logic, protocol translation, and control functions where reconfigurability is required.
• I/O-intensive designs — Use the 300 I/O pins for multi-channel interfaces, parallel peripherals, or mixed-signal front-ends that require many I/O connections.
• Embedded buffering and small data storage — Leverage the on-chip RAM (approximately 0.15 Mbits) for small FIFOs, packet buffering, or temporary data staging.
• Space-constrained PCB layouts — The 484-FPBGA (23×23) surface-mount package suits compact board designs where package density matters.

Unique Advantages

• Substantial logic density — 24,576 logic elements and 1,000,000 gates enable consolidation of multiple discrete functions into a single FPGA, reducing component count.
• High I/O availability — 300 I/O pins simplify system-level integration by providing abundant external connectivity without external I/O expanders.
• On-chip memory for local buffering — Approximately 0.15 Mbits of embedded RAM supports local data handling and low-latency buffering.
• Compact BGA package — The 484-ball FPBGA (23×23) supports high-density PCB designs while maintaining surface-mount assembly compatibility.
• Defined power and temperature envelope — Clear supply (1.425–1.575 V) and commercial operating range (0 °C–85 °C) simplify system power and thermal planning.
• RoHS compliance — Meets common material compliance needs for commercial product manufacturing.

Why Choose M7A3P1000-FGG484?

The M7A3P1000-FGG484 balances mid-range logic capacity, significant I/O count, and on-chip memory in a compact 484-BGA package, making it well suited for commercial embedded designs that require reconfigurable logic and plentiful external connectivity. Its defined voltage and temperature specifications help streamline power-supply design and thermal management for standard commercial deployments.

Manufactured by Microchip Technology and available in a surface-mount FPBGA, this device is appropriate for engineers seeking a programmable logic solution that consolidates multiple functions, reduces BOM complexity, and fits space-constrained PCBs while adhering to RoHS requirements.

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