M7A3P1000-FGG256I

The M7A3P1000-FGG256I is a ProASIC3 field-programmable gate array (FPGA) IC from Microchip Technology. It provides a mid-density programmable logic solution with 24,576 logic elements and roughly 147,456 bits of embedded RAM for implementing custom digital functions.

Designed for industrial-grade applications, the device combines a 1,000,000-gate equivalent capacity with 177 user I/Os in a compact 256-LBGA (256-FPBGA, 17×17) package, and operates over a -40 °C to 100 °C range with a core supply of 1.425 V to 1.575 V.

Key Features

• Core Capacity  24,576 logic elements providing a 1,000,000-gate equivalent for medium-density programmable designs.
• Embedded Memory  Approximately 0.147 Mbits (147,456 bits) of on-chip RAM for buffering, state storage, and local data processing.
• I/O and Connectivity  177 user I/Os to support a broad mix of peripheral interfaces and system interconnects.
• Power  Core voltage supply range of 1.425 V to 1.575 V to match low-voltage system architectures.
• Package and Mounting  Available in a 256-LBGA package (supplier device package: 256-FPBGA, 17×17) for surface-mount assembly and compact board-level integration.
• Industrial Temperature Grade  Specified operating range from -40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance  RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control and Automation  Use the device to implement custom control logic, I/O aggregation, and protocol bridging within industrial temperature and reliability requirements.
• Communications and Networking  Leverage the gate density and 177 I/Os for medium-density packet processing, protocol adaptation, and interface conversion.
• Instrumentation and Test Equipment  Deploy embedded RAM and plentiful logic elements for real-time data acquisition, buffering, and signal conditioning tasks.
• Embedded System Prototyping  Integrate configurable logic and on-chip memory to validate system architectures and accelerate development of custom digital subsystems.

Unique Advantages

• Substantial Logic Density: 24,576 logic elements and a 1,000,000-gate equivalent enable complex digital functions without an oversized footprint.
• On-Chip Memory: Approximately 147,456 bits of embedded RAM supports local data storage and reduces the need for external memory in many designs.
• High I/O Count: 177 user I/Os provide flexibility to interface with multiple peripherals and system buses directly.
• Industrial-Grade Operation: Rated for -40 °C to 100 °C operation, suitable for harsh or temperature-variable deployments.
• Compact, Surface-Mount Packaging: 256-LBGA (17×17 FPBGA) package allows high-density board integration while maintaining manufacturability.
• RoHS Compliant: Environmentally compliant materials support modern manufacturing and procurement requirements.

Why Choose M7A3P1000-FGG256I?

The M7A3P1000-FGG256I positions itself as a robust, mid-density implementation of Microchip Technology's ProASIC3 FPGA family—balancing logic capacity, embedded memory, and a high I/O count in a compact industrial package. Its specification set supports a wide range of system-level tasks where reliable operation across a broad temperature range and low-voltage core compatibility are required.

Engineers and procurement teams seeking a scalable, programmable solution for industrial, communications, or instrumentation designs will find the device a practical option for consolidating functionality, simplifying BOMs, and accelerating time-to-market while maintaining design flexibility within the ProASIC3 family.

If you would like pricing, availability, or to request a formal quote for M7A3P1000-FGG256I, submit a procurement inquiry or request a quote from our sales team today.