M7A3P1000-FGG256

The M7A3P1000-FGG256 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology. It provides a programmable logic platform with 24,576 logic elements and on-chip embedded RAM, delivered in a 256-LBGA surface-mount package.

With 177 user I/O, roughly 0.15 Mbits of embedded memory, and a 1,000,000-gate capacity, this commercial-grade device targets designs that require medium-density programmable logic, flexible I/O, and compact board-level integration.

Key Features

• Core Logic 24,576 logic elements (LEs) providing a 1,000,000-gate equivalent for implementing custom digital functions.
• Embedded Memory Total on-chip RAM of 147,456 bits (approximately 0.15 Mbits) for local data buffering and state storage.
• I/O Count 177 user I/O pins to support multiple parallel interfaces and board-level connectivity.
• Package and Mounting Supplied in a 256-LBGA package (supplier device package: 256-FPBGA 17×17) optimized for surface-mount assembly.
• Power Nominal supply range of 1.425 V to 1.575 V for the device core.
• Operating Conditions Commercial operating temperature range from 0 °C to 85 °C.
• Regulatory RoHS compliant for lead-free assembly and environmental compliance.

Typical Applications

• Embedded Control and Logic Use the device to implement custom control logic and glue-logic with its 24,576 logic elements and abundant I/O.
• Interface Bridging Leverage 177 I/O pins to bridge or adapt between multiple digital interfaces on a single board.
• Prototyping and Development Suitable for medium-density prototype platforms where reprogrammable logic and on-chip RAM simplify iterative design.

Unique Advantages

• Moderate-density logic capacity: 24,576 logic elements and a 1,000,000-gate equivalent enable substantial custom logic without excessive board-level complexity.
• On-chip RAM for local buffering: Approximately 0.15 Mbits of embedded memory reduces dependence on external RAM for small data storage and state machines.
• High I/O count: 177 user I/O pins make it easier to integrate multiple peripherals and parallel interfaces on a compact PCB.
• Compact surface-mount package: 256-LBGA (256-FPBGA 17×17) supports high-density PCB layouts while maintaining manufacturability.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation to match typical commercial embedded system environments.
• Vendor-backed documentation: Supported by Microchip Technology product documentation for design reference and integration.

Why Choose M7A3P1000-FGG256?

The M7A3P1000-FGG256 positions itself as a mid-density programmable logic device combining 24,576 logic elements, substantial I/O, and embedded RAM in a compact 256-LBGA package. It is well suited for commercial embedded designs that need flexible, reprogrammable logic, local memory for buffering, and a high pin count for interface integration.

Engineers and purchasers seeking a balanced solution for prototyping, control logic, or interface adaptation will find the M7A3P1000-FGG256 offers a clear mix of capacity, I/O flexibility, and package density backed by Microchip Technology documentation and RoHS compliance.

Request a quote or contact sales to discuss availability, lead times, and pricing for the M7A3P1000-FGG256.