M7A3P1000-FGG484I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA |
|---|---|
| Quantity | 547 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 300 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of M7A3P1000-FGG484I – ProASIC3 Field Programmable Gate Array (FPGA) IC 300 147456 484-BGA
The M7A3P1000-FGG484I is a ProASIC3 FPGA in a 484-ball BGA surface-mount package, offering a balance of logic capacity, I/O density, and industrial-grade operating range. With 24,576 logic elements (CLBs), approximately 0.147 Mbits of embedded memory, and 300 I/O pins, it is suited for embedded and industrial designs that require deterministic programmable logic and robust thermal performance.
Designed for low-voltage core operation (1.425 V to 1.575 V) and RoHS compliance, this device accommodates applications that need significant on-chip resources in a compact 23 × 23 484-FPBGA footprint while supporting operation from −40 °C to 100 °C.
Key Features
- Core Logic Provides 24,576 logic elements (CLBs) and approximately 1,000,000 gates for complex combinational and sequential logic implementations.
- Embedded Memory Includes approximately 0.147 Mbits of on-chip RAM to support buffering, state storage, and small data tables.
- I/O Density 300 I/O pins enable extensive peripheral and bus connectivity for multi-interface designs.
- Package and Mounting 484-ball FPBGA (23 × 23) package in a surface-mount form factor for space-efficient PCB integration.
- Power Low-voltage core operation with a supply range of 1.425 V to 1.575 V to align with modern power architectures.
- Temperature and Grade Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environments.
- Compliance RoHS compliant for environmental regulatory alignment.
Typical Applications
- Industrial Control Custom logic for motor control, PLC interfaces, and deterministic I/O aggregation where industrial temperature operation is required.
- Embedded Systems On-board programmable logic for protocol bridging, peripheral control, and system glue logic in compact, board-level designs.
- Communications and Networking Protocol handling, parallel/serial interface adaptation, and packet preprocessing using abundant I/O and logic resources.
- Test & Measurement Signal conditioning, timing-critical data capture, and hardware-accelerated preprocessing in bench or rack systems.
Unique Advantages
- High logic capacity: 24,576 logic elements and approximately 1,000,000 gates provide headroom for complex state machines and datapaths.
- Substantial I/O resources: 300 I/O pins let designers implement multiple interfaces and parallel connections without external multiplexing.
- Compact BGA package: 484-ball FPBGA (23 × 23) enables dense PCB layouts while maintaining a surface-mount assembly profile.
- Industrial operating range: Rated from −40 °C to 100 °C to support a wide range of field-deployed and factory-floor applications.
- Low-voltage core: Core supply range of 1.425 V to 1.575 V aligns with contemporary power domains for efficient system integration.
- Regulatory alignment: RoHS compliance supports environmentally conscious product development and supply-chain requirements.
Why Choose M7A3P1000-FGG484I?
The M7A3P1000-FGG484I positions itself as a versatile, industrial-grade programmable logic device that combines substantial logic resources, a high I/O count, and a compact BGA package. It is well suited for embedded and industrial OEMs who need on-chip resources for protocol handling, control logic, and interface consolidation within a constrained PCB footprint.
With support for a broad operating temperature range and RoHS compliance, this FPGA offers a pragmatic option for designs that require durability, integration, and predictable supply-voltage requirements, enabling scalable hardware implementations across multiple product variants.
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