OR2T26A6BA352I-DB

The OR2T26A6BA352I-DB is an ORCA™2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, designed for industrial-grade programmable logic applications. It combines 2,304 logic elements, approximately 36,864 bits of on-chip RAM, and 384 user I/O in a compact 352-BBGA package to meet space- and I/O-constrained designs requiring reconfigurable logic.

Key Features

• Logic Core — 576 CLBs providing a total of 2,304 logic elements for implementing custom digital logic and glue functions.
• Embedded Memory — Approximately 36,864 bits of on-chip RAM to support small buffers, FIFOs, and state storage without external memory.
• I/O Density — 384 user I/O pins to accommodate dense peripheral connectivity and parallel interfaces directly on-chip.
• Gate Count — 63,600 gates for mapping combinational and sequential logic resources.
• Power — Single supply range of 3.0 V to 3.6 V to match common system rails.
• Package & Mounting — 352-BBGA package (supplier device package: 352-PBGA, 35×35) in a surface-mount form factor for compact PCB integration.
• Operating Conditions — Industrial-grade operation from −40 °C to 85 °C for deployed systems in temperature‑varied environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Automation — Use the device’s industrial temperature range and 384 I/O to implement control logic, sensor aggregation, and I/O interfacing on factory equipment.
• Embedded Systems — Implement custom state machines, protocol bridges, and glue logic using 2,304 logic elements and on-chip RAM to minimize external components.
• High‑Density I/O Modules — Leverage 384 user I/O and the compact 352-BBGA package for space-constrained modules that require many signals routed to the FPGA.

Unique Advantages

• High logic integration: 2,304 logic elements and 63,600 gates allow substantial on-chip implementation of custom digital functions, reducing external ASIC or discrete logic needs.
• On-chip memory: Approximately 36,864 bits of embedded RAM support small FIFOs, buffers, and state storage without adding external memory devices.
• Dense I/O capability: 384 user I/O pins simplify board-level routing for systems that require multiple interfaces or parallel connections.
• Industrial readiness: Rated for −40 °C to 85 °C operation and RoHS compliant, suitable for deployed industrial electronics.
• Compact package: 352-BBGA (352-PBGA, 35×35) surface-mount package enables high-density PCB layouts and small form-factor designs.
• Standard voltage compatibility: 3.0 V to 3.6 V supply range aligns with common system power rails, simplifying power design.

Why Choose OR2T26A6BA352I-DB?

The OR2T26A6BA352I-DB combines a balanced mix of logic density, on-chip memory, and high I/O count in a compact BGA package targeted at industrial applications. Its industrial temperature rating and RoHS compliance make it suitable for deployed systems where environmental robustness and regulatory compliance matter.

Backed by Lattice Semiconductor Corporation, this ORCA™2 FPGA is well suited for designers seeking a programmable logic device that reduces external component count, supports dense signal routing, and fits into space-constrained boards while operating on common 3.0–3.6 V rails.

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