OR2T26A6PS240I-DB

FPGA, 576 CLBS, 27600 GATES
Part Description

ORCA™2 Field Programmable Gate Array (FPGA) IC 384 36864 2304 240-BFQFP Exposed Pad

Quantity 536 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package240-SQFP2 (32x32)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case240-BFQFP Exposed PadNumber of I/O384Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells2304
Number of Gates63600ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of OR2T26A6PS240I-DB – ORCA™2 Field Programmable Gate Array (FPGA) IC, 384 I/Os, 2304 Logic Elements, 240-BFQFP

The OR2T26A6PS240I-DB is an ORCA™2 Field Programmable Gate Array (FPGA) integrated circuit from Lattice Semiconductor Corporation. It delivers moderate logic density combined with extensive I/O and on-chip RAM for embedded and industrial applications.

With 2304 logic elements, approximately 36,864 bits of on-chip RAM, and 384 I/O pins housed in a 240-BFQFP exposed pad package, this device targets designs that require a balance of logic resources, memory, and high pin count within an industrial temperature range.

Key Features

  • Logic Capacity  2304 logic elements providing the programmable logic resources needed for glue logic, protocol bridging, and control functions.
  • Embedded Memory  Approximately 36,864 bits of on-chip RAM for FIFO, buffering, and small data storage requirements.
  • High I/O Count  384 I/O pins support extensive peripheral, sensor and interface connectivity in a single device.
  • Gate Scale  63,600 total gates for implementing combinational and sequential logic structures.
  • Power  Operates from a 3 V to 3.6 V supply, enabling compatibility with common 3.3 V systems.
  • Package and Mounting  240-BFQFP exposed pad package (supplier package: 240-SQFP2, 32×32) in a surface-mount form factor for board-level assembly.
  • Industrial Temperature Range  Rated for operation from −40 °C to 85 °C, suitable for industrial environments.
  • Environmental Compliance  RoHS compliant, meeting common lead-free requirements for commercial and industrial electronics.

Typical Applications

  • Industrial Control  Industrial systems that require reliable operation across −40 °C to 85 °C and flexible I/O for sensor, actuator, or communication interfacing.
  • Embedded Interface Bridging  High I/O count and on-chip RAM make it suitable for bridging or aggregating multiple peripheral interfaces in embedded systems.
  • Signal Aggregation and Glue Logic  Moderate logic density and abundant I/O allow consolidation of glue logic and signal routing onto a single programmable device.

Unique Advantages

  • Balanced Resource Set:  2304 logic elements together with approximately 36,864 bits of RAM provide a practical mix of logic and memory for medium-complexity designs.
  • Extensive I/O Integration:  384 I/O pins reduce the need for external multiplexers or expansion devices, simplifying board layout and BOM.
  • Industrial Readiness:  Operation from −40 °C to 85 °C and surface-mount packaging make the device suitable for industrial deployments.
  • Standard 3.3 V Supply:  3 V to 3.6 V supply range aligns with common 3.3 V system architectures, easing power-system design.
  • Compact, Assembly-Friendly Package:  240-BFQFP exposed pad in a 32×32 supplier footprint offers a high-pin-count solution in a manufacturable surface-mount form.
  • RoHS Compliant:  Conforms to lead-free manufacturing requirements for regulatory and environmental compatibility.

Why Choose OR2T26A6PS240I-DB?

The OR2T26A6PS240I-DB is positioned for designs that need a pragmatic combination of logic density, on-chip memory, and a high number of I/Os, all within an industrial temperature range. Its 2304 logic elements, 384 I/Os and approximately 36,864 bits of embedded RAM make it a solid choice for embedded systems, control applications, and interface consolidation on space- and cost-conscious PCBs.

Manufactured by Lattice Semiconductor Corporation and provided in a 240-BFQFP exposed pad package, this FPGA offers a durable, RoHS-compliant option for teams looking to streamline hardware design while meeting industrial operating conditions.

Request a quote or submit an inquiry to start a purchase conversation for the OR2T26A6PS240I-DB FPGA. Our team can provide pricing, availability, and order assistance.

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