OR2T26A6PS240I-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 384 36864 2304 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 536 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 240-SQFP2 (32x32) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 384 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 576 | Number of Logic Elements/Cells | 2304 | ||
| Number of Gates | 63600 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of OR2T26A6PS240I-DB – ORCA™2 Field Programmable Gate Array (FPGA) IC, 384 I/Os, 2304 Logic Elements, 240-BFQFP
The OR2T26A6PS240I-DB is an ORCA™2 Field Programmable Gate Array (FPGA) integrated circuit from Lattice Semiconductor Corporation. It delivers moderate logic density combined with extensive I/O and on-chip RAM for embedded and industrial applications.
With 2304 logic elements, approximately 36,864 bits of on-chip RAM, and 384 I/O pins housed in a 240-BFQFP exposed pad package, this device targets designs that require a balance of logic resources, memory, and high pin count within an industrial temperature range.
Key Features
- Logic Capacity 2304 logic elements providing the programmable logic resources needed for glue logic, protocol bridging, and control functions.
- Embedded Memory Approximately 36,864 bits of on-chip RAM for FIFO, buffering, and small data storage requirements.
- High I/O Count 384 I/O pins support extensive peripheral, sensor and interface connectivity in a single device.
- Gate Scale 63,600 total gates for implementing combinational and sequential logic structures.
- Power Operates from a 3 V to 3.6 V supply, enabling compatibility with common 3.3 V systems.
- Package and Mounting 240-BFQFP exposed pad package (supplier package: 240-SQFP2, 32×32) in a surface-mount form factor for board-level assembly.
- Industrial Temperature Range Rated for operation from −40 °C to 85 °C, suitable for industrial environments.
- Environmental Compliance RoHS compliant, meeting common lead-free requirements for commercial and industrial electronics.
Typical Applications
- Industrial Control Industrial systems that require reliable operation across −40 °C to 85 °C and flexible I/O for sensor, actuator, or communication interfacing.
- Embedded Interface Bridging High I/O count and on-chip RAM make it suitable for bridging or aggregating multiple peripheral interfaces in embedded systems.
- Signal Aggregation and Glue Logic Moderate logic density and abundant I/O allow consolidation of glue logic and signal routing onto a single programmable device.
Unique Advantages
- Balanced Resource Set: 2304 logic elements together with approximately 36,864 bits of RAM provide a practical mix of logic and memory for medium-complexity designs.
- Extensive I/O Integration: 384 I/O pins reduce the need for external multiplexers or expansion devices, simplifying board layout and BOM.
- Industrial Readiness: Operation from −40 °C to 85 °C and surface-mount packaging make the device suitable for industrial deployments.
- Standard 3.3 V Supply: 3 V to 3.6 V supply range aligns with common 3.3 V system architectures, easing power-system design.
- Compact, Assembly-Friendly Package: 240-BFQFP exposed pad in a 32×32 supplier footprint offers a high-pin-count solution in a manufacturable surface-mount form.
- RoHS Compliant: Conforms to lead-free manufacturing requirements for regulatory and environmental compatibility.
Why Choose OR2T26A6PS240I-DB?
The OR2T26A6PS240I-DB is positioned for designs that need a pragmatic combination of logic density, on-chip memory, and a high number of I/Os, all within an industrial temperature range. Its 2304 logic elements, 384 I/Os and approximately 36,864 bits of embedded RAM make it a solid choice for embedded systems, control applications, and interface consolidation on space- and cost-conscious PCBs.
Manufactured by Lattice Semiconductor Corporation and provided in a 240-BFQFP exposed pad package, this FPGA offers a durable, RoHS-compliant option for teams looking to streamline hardware design while meeting industrial operating conditions.
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Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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