OR2T26A6BC432-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 384 36864 2304 432-LBGA |
|---|---|
| Quantity | 66 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 432-SBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA | Number of I/O | 384 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 576 | Number of Logic Elements/Cells | 2304 | ||
| Number of Gates | 63600 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of OR2T26A6BC432-DB – ORCA™2 Field Programmable Gate Array (FPGA) IC 384 36864 2304 432-LBGA
The OR2T26A6BC432-DB is an ORCA™2 series Field Programmable Gate Array (FPGA) device designed for commercial embedded applications. It combines on-chip logic, embedded RAM, and a large I/O count in a compact 432-LBGA package to address custom logic, interface consolidation, and control tasks.
With 2,304 logic elements, 36,864 bits of on-chip RAM and 384 I/O, this FPGA is positioned to provide a balance of logic capacity and connectivity while operating from a 3.0 V to 3.6 V supply within a 0 °C to 70 °C commercial temperature range.
Key Features
- Core Logic Approximately 2,304 logic elements and a gate-equivalent count of 63,600 provide measurable digital resource capacity for custom logic implementation.
- Embedded Memory 36,864 bits of on-chip RAM for buffering, small lookup tables, or state storage without requiring external memory components.
- High I/O Density 384 available I/O pins support multiple external connections and interface consolidation in a single device.
- Package & Mounting 432-LBGA (supplier package: 432-SBGA, 40×40) surface-mount package suitable for compact PCB layouts.
- Power Rated for operation from 3.0 V to 3.6 V, enabling integration into standard commercial power domains.
- Temperature & Grade Commercial-grade operation from 0 °C to 70 °C for mainstream consumer and industrial-lite applications.
- Environmental Compliance RoHS-compliant to meet common environmental and sourcing requirements.
Typical Applications
- Commercial Embedded Systems Implement custom control logic and glue-logic for consumer and industrial-lite products that operate within standard commercial temperature ranges.
- Interface Consolidation Use the device’s 384 I/O to combine multiple peripheral interfaces and simplify PCB routing in compact systems.
- Prototyping and Small FPGA Designs Leverage the on-chip logic and RAM to develop and validate custom digital functions in early-stage designs.
- Compact System Control Deploy in space-constrained applications where a 432-LBGA package and surface-mount mounting are required.
Unique Advantages
- Measured Logic Capacity: Approximately 2,304 logic elements and 63,600 gate equivalents provide clear, quantifiable design headroom for defined functionality.
- Embedded RAM Reduces External Parts: 36,864 bits of on-chip memory enable local buffering and state retention without adding external memory devices.
- Extensive I/O: 384 I/O pins support dense connectivity and reduce the need for additional interface components.
- Compact LBGA Footprint: 432-LBGA (40×40) package allows high pin count in a small PCB area for more compact product designs.
- Commercial-Grade Availability: Designed for 0 °C to 70 °C operation and surface-mount assembly to match commercial production and deployment environments.
- RoHS Compliant: Meets common environmental compliance expectations for modern electronics manufacturing.
Why Choose OR2T26A6BC432-DB?
The OR2T26A6BC432-DB delivers a practical balance of logic capacity, on-chip memory, and extensive I/O in a compact 432-LBGA surface-mount package suited to commercial embedded applications. Its clear electrical and environmental specifications—3.0 V to 3.6 V supply, 0 °C to 70 °C operating range, and RoHS compliance—make integration and procurement straightforward for design teams.
This device is well suited to designers who need quantifiable logic and memory resources, high I/O density, and a compact form factor for commercial products. Its specification set supports predictable system design, streamlined BOMs, and straightforward deployment in commercial environments.
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