OR2T26A6S208I-DB

The OR2T26A6S208I-DB is a field-programmable gate array (FPGA) from the ORCA® Series 2 family. It provides 2,304 logic elements organized as 576 CLBs and on-chip embedded memory to support mid-density embedded logic and control functions.

Designed for industrial-grade use, the device combines a 208-BFQFP package, 171 user I/Os, and a 3.0–3.6 V supply range with an extended operating temperature from −40 °C to 85 °C, delivering a balanced mix of integration, I/O density, and robustness for industrial and embedded applications.

Key Features

• Logic Capacity — 2,304 logic elements implemented across 576 CLBs to support moderate-complexity digital designs.
• On-Chip Memory — 36,864 bits of embedded RAM for buffering, state machines, and small data storage needs.
• I/O Density — 171 user I/Os to connect a broad range of peripherals and system interfaces on a single device.
• Gate Equivalent — 63,600 gates (logic-only figure) for sizing and partitioning system logic.
• Power and Supply — Operates from a 3.0 V to 3.6 V supply range compatible with common 3.3 V systems.
• Package and Mounting — 208-BFQFP package (supplier device package: 208-PQFP, 28×28) for surface-mount PCB assembly.
• Industrial Temperature Range — Rated for −40 °C to 85 °C operation, suitable for industrial environments.
• Standards Compliance — RoHS compliant.
• ORCA® Series 2 Characteristics — Part of the ORCA Series 2 family, which the datasheet describes as high-performance, cost-effective, and low-power CMOS FPGA technology.

Typical Applications

• Industrial Control — Use the device for embedded control logic and I/O management where industrial temperature operation and a high I/O count are required.
• Embedded System Glue Logic — Implement protocol bridging, custom peripherals, and interface adaptation using the device’s logic capacity and 171 I/Os.
• Low- to Mid-Complexity FPGA Designs — Deploy for systems needing several thousand logic elements and modest on-chip RAM without external memory.

Unique Advantages

• Balanced Integration: 2,304 logic elements and 36,864 bits of RAM allow integration of control, interface, and data-path functions on a single IC, reducing board-level component count.
• Generous I/O Count: 171 user I/Os enable dense peripheral connectivity and minimize the need for multiplexing or external I/O expanders.
• Industrial-Grade Reliability: Rated for −40 °C to 85 °C and RoHS compliant, supporting deployment in demanding industrial environments.
• Package Flexibility: 208-BFQFP (208-PQFP, 28×28) surface-mount package simplifies PCB layout for medium-pin-count designs.
• Series-Level Efficiency: As a member of the ORCA® Series 2 family, the device benefits from the series’ focus on cost-effective, low-power CMOS FPGA architectures.

Why Choose OR2T26A6S208I-DB?

The OR2T26A6S208I-DB positions itself as a mid-density, industrial-grade FPGA that combines a clear balance of logic resources, embedded memory, and a high I/O count in a compact surface-mount 208-BFQFP package. Its 3.0–3.6 V supply range and −40 °C to 85 °C operating window make it appropriate for industrial embedded designs that require reliable operation across temperature extremes.

Choose this device when you need a proven ORCA® Series 2 FPGA platform to consolidate digital functions, reduce BOM complexity, and maintain design flexibility across control and interface tasks.

Request a quote or submit a part request to receive pricing and availability for OR2T26A6S208I-DB. Our team will respond with lead-time and ordering information tailored to your project needs.