XC2S30-5PQ208I

The XC2S30-5PQ208I is an AMD Spartan®-II field programmable gate array (FPGA) delivered in a 208-BFQFP surface-mount package. It provides a compact programmable logic solution with 216 CLBs, approximately 972 logic elements, 140 user I/O and roughly 24.6 kbits of on-chip RAM.

Designed for industrial-temperature operation, this device supports a supply voltage range of 2.375 V to 2.625 V and an operating temperature range of -40 °C to 100 °C, making it suitable for temperature-restricted embedded and control applications that require configurable logic and substantial I/O capacity.

Key Features

• Logic Capacity — 216 CLBs and approximately 972 logic elements provide targeted programmable logic resources for control, glue-logic and small to medium FPGA tasks.
• Embedded Memory — Total on-chip RAM of 24,576 bits (approximately 0.025 Mbits) to support small frame buffers, FIFOs and state storage without external memory.
• I/O — 140 user I/O pins to interface with sensors, peripherals, and external devices in compact system designs.
• Gate Equivalent — Device capacity equivalent to 30,000 gates for estimating logic complexity in system architectures.
• Package & Mounting — 208-BFQFP package (supplier package 208-PQFP, 28×28) in a surface-mount form factor for PCB assembly compatibility.
• Power — Supports a core voltage range of 2.375 V to 2.625 V, enabling integration into systems with defined supply rails.
• Industrial Temperature Range — Rated for -40 °C to 100 °C operation and identified as industrial grade for temperature-constrained environments.
• RoHS Compliant — Meets RoHS environmental requirements for restricted substances.

Typical Applications

• Industrial Control — Use the XC2S30-5PQ208I to implement control logic, I/O aggregation and timing functions in automated equipment where industrial temperature range is required.
• Embedded Systems — Deploy as a programmable logic element for small to medium embedded designs that need flexible interfacing and modest on-chip memory.
• Interface and Glue Logic — Replace discrete glue logic with a single FPGA to consolidate signal translation, protocol bridging and I/O management across 140 pins.

Unique Advantages

• Balanced Logic and I/O: Combination of 216 CLBs and 140 I/O pins enables versatile partitioning between computation and interfacing without excessive board complexity.
• Compact Surface-Mount Package: 208-BFQFP (28×28 supplier PQFP) offers a space-efficient footprint for PCB designs requiring many I/O lines.
• Industrial Temperature Rating: Rated from -40 °C to 100 °C for deployment in temperature-challenging environments.
• On-Chip Memory: Approximately 24.6 kbits of embedded RAM reduces reliance on external memory for small buffers and state machines.
• Known Manufacturer: Sourced from AMD and identified as a Spartan®-II family device for compatibility with legacy design considerations where Spartan-II devices are specified.

Why Choose XC2S30-5PQ208I?

The XC2S30-5PQ208I positions itself as a compact, industrial-grade FPGA option that combines moderate logic density, substantial I/O and on-chip RAM in a 208-pin surface-mount package. Its voltage and temperature specifications support stable operation in embedded and control-oriented applications.

This part is well suited for designers and procurement teams seeking a programmable logic device for small to medium complexity designs that require industrial temperature performance, a high pin count, and a compact package format.

If you would like pricing, availability or to request a quote for the XC2S30-5PQ208I, submit an inquiry or request a quote through your usual procurement channels.