XC2S30-5CSG144I

The XC2S30-5CSG144I is an AMD Spartan®-II Field Programmable Gate Array (FPGA) provided in a 144-TFBGA/CSPBGA package. It integrates 972 logic elements, approximately 24.6 Kbits of embedded RAM (24,576 bits), and 92 user I/Os within a 30,000-gate-class device.

This device is specified for industrial-grade operation with a supply window of 2.375 V to 2.625 V and an operating temperature range of −40 °C to 100 °C, making it suited to applications that require modest logic density, on-chip RAM, and a compact BGA footprint.

Key Features

• Core Logic  Approximately 972 logic elements (216 CLBs) and a 30,000-gate equivalent provide programmable digital logic capacity for glue logic, control functions, and small to medium combinational/sequential designs.
• Embedded Memory  Approximately 24.6 Kbits (24,576 bits) of on-chip RAM for buffering, small FIFOs, or lookup tables.
• I/O Resources  92 user I/Os support a variety of external interfaces and signal routing within a compact package.
• Power  Device operates from a core supply range of 2.375 V to 2.625 V, enabling integration into low-voltage digital systems.
• Package & Mounting  Supplied in a 144-TFBGA (CSPBGA) package; supplier device package listed as 144-LCSBGA (12×12). Surface-mount mounting type supports compact PCB layouts.
• Temperature & Grade  Industrial-grade device rated for −40 °C to 100 °C operation.
• Environmental  RoHS-compliant construction.

Typical Applications

• Industrial Control  Implement control logic and finite-state machines that benefit from the device’s industrial temperature range and on-chip RAM for state and buffering.
• Interface and Glue Logic  Bridge peripherals and manage signal translation using the device’s 92 user I/Os and flexible programmable logic resources.
• Embedded System I/O Expansion  Add custom I/O handling, simple protocol conversion, or peripheral aggregation where moderate logic density and embedded RAM are sufficient.

Unique Advantages

• Compact BGA Footprint: The 144-TFBGA (144-LCSBGA 12×12) package enables space-constrained PCB designs without sacrificing I/O count.
• Balanced Logic and Memory: 972 logic elements paired with approximately 24.6 Kbits of embedded RAM provide a practical balance for control, interfacing, and buffering tasks.
• Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in environments requiring extended temperature tolerance.
• Low-Voltage Core Compatibility: The 2.375 V to 2.625 V supply range aligns the device with low-voltage digital systems and power domains.
• Regulatory Compliance: RoHS compliance simplifies environmental and manufacturing planning.

Why Choose XC2S30-5CSG144I?

The XC2S30-5CSG144I positions itself as a compact, industrial-grade FPGA option for designs that require a modest amount of programmable logic, embedded RAM, and a substantial I/O count in a small BGA package. Its specified operating temperature range and RoHS compliance make it suitable for long-term deployment in controlled industrial environments.

Designers seeking a low-voltage, mid-density FPGA for interface tasks, control logic, or I/O expansion will find the XC2S30-5CSG144I a practical choice that balances integration, thermal tolerance, and board-area efficiency.

If you would like pricing, availability, or to request a formal quote for the XC2S30-5CSG144I, please submit your request and our team will assist you.