XC2S200E-6PQG208C

The XC2S200E-6PQG208C is a Spartan®-IIE family field-programmable gate array (FPGA) offered in a 208‑BFQFP surface-mount package. It delivers a balance of on-chip logic, embedded memory, and I/O resources suitable for cost-sensitive commercial applications and ASIC-replacement designs.

Built around the Spartan‑IIE architecture, this device combines 5,292 logic elements with approximately 57,344 bits of on-chip RAM and 146 user I/O pins, providing a compact, reprogrammable platform for embedded control, digital interfacing, and prototype development.

Key Features

• Core Logic — 5,292 logic elements (reported as logic cells) enabling mid-range integration of combinatorial and sequential logic functions.
• Embedded Memory — 57,344 total RAM bits (approximately 57.3 Kbits) for on‑chip data buffering, FIFOs, and small lookup tables.
• I/O Capacity — 146 user I/O pins to support a wide range of peripheral and interface connections.
• System Gates — 200,000 system gates equivalent, offering a metric for overall device density.
• Package and Mounting — 208‑BFQFP (supplier package listed as 208‑PQFP, 28×28) in a surface-mount form factor for PCB assembly.
• Power Supply — Core operating voltage range specified at 1.71 V to 1.89 V.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Standards & Compliance — RoHS compliant, supporting lead‑free manufacturing requirements.

Typical Applications

• ASIC Replacement & Prototyping — Implements custom logic functions and enables field reprogrammability as an alternative to mask-programmed ASICs.
• Embedded System Control — Integrates control logic and I/O handling for embedded devices that require moderate logic density and on‑chip RAM.
• Interface Bridging — Uses the device’s 146 I/O pins to bridge and manage parallel and serial interfaces between subsystems on a PCB.
• Design Verification & Development — Serves as a development platform for validating logic architectures prior to ASIC implementation or higher‑density FPGA migration.

Unique Advantages

• Balanced integration: Combines 5,292 logic elements with on‑chip RAM and 146 I/O pins to consolidate functions and reduce external component count.
• Compact packaging: Available in a 208‑BFQFP surface‑mount package suitable for space‑constrained PCBs while maintaining substantial I/O.
• Commercial-grade operation: Rated for 0 °C to 85 °C, appropriate for standard commercial environments and product deployments.
• Low-voltage core: Core supply specified between 1.71 V and 1.89 V, enabling compatibility with low-voltage system designs.
• RoHS compliant: Aligns with lead‑free manufacturing processes for regulatory and environmental requirements.

Why Choose XC2S200E-6PQG208C?

The XC2S200E-6PQG208C provides a pragmatic balance of logic density, embedded memory, and I/O in a commercially graded, RoHS-compliant package. It is well suited to teams seeking a reprogrammable platform for ASIC replacement, prototype development, and embedded control where moderate gate counts and on‑chip RAM are required.

With clear electrical and mechanical specifications—including core voltage range, package type, and operating temperature—this Spartan®-IIE device offers predictable integration into commercial electronic designs while simplifying board-level routing and component selection.

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