XC2S200E-6FGG456C

The XC2S200E-6FGG456C is a Spartan®-IIE family field-programmable gate array (FPGA) in a 456-ball BGA package, designed for commercial-grade embedded designs and system-level integration. It combines on-chip logic, embedded RAM, and extensive I/O to support applications that require in-field reprogrammability and flexible system interfacing.

As part of the Spartan-IIE family, this device targets designs that benefit from abundant logic resources and a rich feature set—offering a practical alternative to mask-programmed ASICs and enabling design upgrades without hardware replacement.

Key Features

• Core Logic – 5,292 logic elements and approximately 200,000 system gates provide the device's programmable fabric for implementing custom digital functions.
• Embedded Memory – 57,344 bits of on-chip RAM available for buffering, FIFOs, or small data stores within the FPGA fabric.
• I/O Capacity & Package – 289 user I/O pins in a 456-ball BGA (supplier package: 456-FBGA, 23×23) with surface-mount mounting for compact, high-density board designs.
• Voltage and Power – Core supply voltage range of 1.71 V to 1.89 V to match system power rails and design constraints.
• Operating Conditions – Commercial-grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.
• Spartan-IIE Family Capabilities – Family-level features include block RAM and distributed RAM architectures, multiple selectable I/O standards, delay-locked loops (DLLs) for clock control, and IEEE 1149.1-compatible boundary-scan support (as documented in the Spartan-IIE data sheet).
• Configurable System Integration – In-system reprogrammability and architectural features described for the Spartan-IIE family support iterative development and field updates.

Typical Applications

• ASIC Replacement and Prototyping – Implement and iterate custom logic without the up-front costs and lead times associated with mask-programmed ASICs; in-field reprogramming enables rapid design refinement.
• Embedded Systems – Use the available logic and on-chip RAM for control logic, protocol handling, and peripheral interfaces in compact embedded products.
• High-Density I/O and Interface Bridging – Leverage 289 I/O pins and configurable I/O standards to bridge between system buses, memory interfaces, and peripheral devices.
• System Integration with On-Board Memory Support – Combine embedded RAM with dedicated logic to implement buffering, FIFOs, and small on-chip data stores for real-time processing tasks.

Unique Advantages

• Flexible, Reprogrammable Platform: In-system reprogrammability allows design updates and field modifications without hardware replacement, reducing lifecycle risk.
• Balanced Logic and Memory: The mix of 5,292 logic elements and 57,344 bits of embedded RAM supports control-centric designs that need both combinational/sequential logic and local storage.
• High I/O Count in a Compact Package: 289 I/O pins in a 456-ball BGA provide connectivity density for complex board-level integration while keeping the footprint compact.
• Commercial-Grade Reliability: Specified operating range of 0 °C to 85 °C with RoHS compliance supports standard commercial applications and regulatory requirements for many markets.
• Family-Level Feature Set: Spartan-IIE family characteristics—such as block and distributed RAM, DLLs, and boundary-scan—provide architectural tools for clocking, memory, and system-level testability.

Why Choose XC2S200E-6FGG456C?

The XC2S200E-6FGG456C delivers a practical combination of programmable logic, embedded memory, and a high I/O count in a 456-BBGA surface-mount package. Its Spartan-IIE family heritage provides architectural features that facilitate iterative design, clock management, and on-chip memory organization—useful for teams replacing ASICs, developing prototypes, or integrating custom logic into commercial products.

This device is well suited for designers seeking a commercially graded FPGA with on-board memory and significant I/O capability, offering a scalable platform for mid-density logic implementations and system-level interfacing while maintaining compliance with RoHS requirements.

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