XC2S200E-6FG456C

The XC2S200E-6FG456C is a Spartan®-IIE field programmable gate array (FPGA) in a 456‑ball FBGA (23×23) package. This commercial‑grade FPGA provides a balance of logic capacity, embedded memory, and I/O density for cost‑sensitive system designs requiring programmable logic and in‑system reconfiguration.

Built around the Spartan‑IIE family architecture, the device is suitable for applications that need on‑chip logic (5,292 logic elements), substantial embedded RAM (57,344 bits), and a large I/O count (289 pins) while operating at a low core voltage range (1.71 V to 1.89 V) and standard commercial temperatures (0 °C to 85 °C).

Key Features

• Core Logic Approximately 5,292 logic elements (cells) providing the programmable fabric for custom logic and control functions.
• Embedded Memory 57,344 total on‑chip RAM bits for block and distributed memory needs.
• I/O Density 289 available I/O pins to support complex interfacing and mixed signal routing requirements.
• Logic Capacity Equivalent to 200,000 gates of system logic for mid‑range FPGA applications.
• Package 456‑ball fine‑pitch BGA (456‑FBGA, 23×23) for compact board-level integration and dense routing.
• Power and Supply Core voltage supply range of 1.71 V to 1.89 V to match low‑voltage system rails.
• Operating Range Commercial temperature grade, 0 °C to 85 °C.
• Compliance RoHS compliant.
• Family‑Level Architecture Spartan‑IIE family features (as documented) include block RAM, distributed RAM, selectable I/O standards, and dedicated DLLs for clock control—enabling flexible memory and timing implementations.

Typical Applications

• ASIC Replacement and Prototyping Use as a reprogrammable alternative to mask‑programmed ASICs for low‑cost development and field upgrades.
• System Logic and Control Implement custom glue logic, state machines, and control functions leveraging 5,292 logic elements and abundant I/O.
• On‑Chip Memory Acceleration Buffering, small FIFOs, and lookup tables using 57,344 bits of embedded RAM for faster local data handling.
• Clock and Timing Management Leverage family DLL features for clock distribution and phase control in synchronous designs.

Unique Advantages

• Highly integrated logic and memory: Combines 5,292 logic elements with 57,344 bits of embedded RAM to reduce external component count and simplify board design.
• High I/O capacity: 289 I/O pins enable dense peripheral and bus interfacing without additional multiplexing hardware.
• Compact, manufacturing‑ready package: 456‑FBGA (23×23) offers a small footprint suitable for space‑constrained PCBs.
• Low‑voltage operation: Core supply range of 1.71 V to 1.89 V supports modern low‑voltage system architectures.
• Commercial qualification: Rated for 0 °C to 85 °C operation for mainstream commercial and industrial edge applications.
• RoHS compliant: Meets lead‑free environmental requirements for contemporary manufacturing.

Why Choose XC2S200E-6FG456C?

The XC2S200E-6FG456C delivers a balanced mid‑range FPGA option with measurable on‑chip logic, memory, and I/O resources in a compact BGA package. Its Spartan‑IIE family architecture provides the building blocks—logic cells, embedded RAM, and clock management features—needed for configurable system functions, prototyping, and cost‑sensitive production designs.

This device is well suited to engineering teams seeking a programmable, RoHS‑compliant FPGA that integrates significant logic and memory capacity while operating within standard commercial temperature and low core‑voltage environments. It offers straightforward scalability within the Spartan‑IIE family for evolving design requirements.

Request a quote or submit an inquiry to receive pricing, availability, and technical purchasing information for the XC2S200E-6FG456C.