XC2S200E-6PQ208C

The XC2S200E-6PQ208C is a Spartan®-IIE field-programmable gate array (FPGA) in a 208-BFQFP surface-mount package. It provides 5,292 logic elements, 57,344 bits of on-chip RAM, and 146 user I/O pins for compact, reprogrammable digital designs.

Targeted at cost‑sensitive commercial applications, this device combines on‑chip memory, a significant I/O count, and programmable logic to support prototyping, embedded control, interface aggregation, and other mid-density digital functions within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity — 5,292 logic elements (1,176 CLBs) enabling mid-density digital implementations and combinational/sequential logic integration.
• Embedded Memory — 57,344 bits of total RAM for block and distributed memory requirements within the FPGA fabric.
• I/O Resources — 146 user I/O pins suitable for multiple parallel interfaces and signal aggregation in a single device.
• Gate Equivalent — Approximately 200,000 system gates for estimating system-level integration density.
• Package and Mounting — 208-BFQFP (208-PQFP, 28×28) surface-mount package for board-level deployment where a compact QFP footprint is required.
• Supply Voltage — Core operating range of 1.71 V to 1.89 V, matching the device's specified voltage requirements.
• Operating Grade — Commercial grade device with specified ambient operating temperature from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Embedded Control and Logic — Implement control state machines, protocol handlers, and glue logic using the device’s logic elements and on‑chip RAM.
• Interface Aggregation — Consolidate multiple parallel or serial interfaces into a single programmable device leveraging 146 I/Os.
• Prototyping and In‑System Upgrades — Use the FPGA’s reprogrammability for iterative development and field-updatable logic in commercial products.
• Signal Processing and Buffering — Combine block and distributed RAM with logic resources to implement small buffering, data alignment, and basic processing tasks.

Unique Advantages

• Balanced mid‑density resource set: 5,292 logic elements with 57,344 bits of RAM provides a practical trade-off between capacity and board-level cost for commercial designs.
• High I/O count in a compact package: 146 user I/O pins in a 208‑pin QFP footprint simplify routing and reduce the need for external interface components.
• Surface-mount, production-ready packaging: 208-BFQFP (208‑PQFP 28×28) support eases assembly into compact PCB layouts.
• Defined electrical and thermal limits: Specified core supply range (1.71–1.89 V) and commercial operating temperature (0 °C–85 °C) enable predictable system design and thermal planning.
• Regulatory readiness: RoHS compliance supports inclusion in modern commercial product lines.
• Field reprogrammability: As a member of the Spartan‑IIE family, the device supports reprogrammable logic for in‑field updates and iterative development workflows.

Why Choose XC2S200E-6PQ208C?

The XC2S200E-6PQ208C positions itself as a practical, commercially graded FPGA for mid-density logic tasks where a balance of logic resources, embedded memory, and a substantial I/O count are required. Its 208‑pin QFP package and surface-mount form factor make it suitable for compact board designs that need reprogrammable logic without moving to higher-cost families.

Designers and teams focused on prototyping, control logic, and interface consolidation will find this part useful for reducing discrete component counts while retaining the ability to update logic in-system. The device’s clear electrical and thermal specifications support straightforward integration into commercial product designs.

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