XC2S200E-6PQ208I
| Part Description |
Spartan®-IIE Field Programmable Gate Array (FPGA) IC 146 57344 5292 208-BFQFP |
|---|---|
| Quantity | 406 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 146 | Voltage | 1.71 V - 1.89 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1176 | Number of Logic Elements/Cells | 5292 | ||
| Number of Gates | 200000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57344 |
Overview of XC2S200E-6PQ208I – Spartan®-IIE FPGA, 5,292 Logic Elements, 208-BFQFP
The XC2S200E-6PQ208I is a Spartan®-IIE field-programmable gate array (FPGA) offered by AMD. It integrates 5,292 logic elements and 1,176 configurable logic blocks to deliver programmable logic and system control capability in a compact surface-mount package.
Designed for cost-sensitive, reprogrammable designs, this device is targeted at embedded systems, interface bridging and ASIC-replacement applications where a balance of logic density, on-chip memory and flexible I/O is required. The part is rated for industrial temperature operation and RoHS compliant.
Key Features
- Core Logic — 5,292 logic elements and 1,176 configurable logic blocks provide the programmable fabric for custom logic, control and glue-logic functions.
- Embedded Memory — Approximately 0.057 Mbits (57,344 bits) of on-chip RAM for data buffers, FIFOs and small storage structures.
- I/O Density — 146 user I/O pins to support peripheral interfaces, parallel buses and mixed-signal front-ends.
- Gate Scale — Equivalent to 200,000 system gates for mid-range integration of logic and glue functions.
- Package & Mounting — 208-BFQFP package (supplier package 208-PQFP, 28×28 mm) in a surface-mount form factor for compact PCB layouts.
- Supply Voltage — Core supply range of 1.71 V to 1.89 V suitable for the device’s internal power domain.
- Operating Temperature — Industrial grade operation from −40 °C to 100 °C for reliable use in a wide range of environments.
- Environmental Compliance — RoHS compliant for lead-free manufacturing processes.
- Family-Level Features — Spartan-IIE family capabilities (documented in the device datasheet) include architectural features such as block RAM and advanced clock control intended to support system-level designs.
Typical Applications
- ASIC Replacement & Prototyping — Implement and iterate custom logic in-system without the non-recurring cost of mask-programmed ASICs.
- Embedded Control — Serve as a programmable controller for motor drives, machine control, and other embedded applications requiring deterministic logic and I/O handling.
- Interface Bridging & I/O Expansion — Aggregate and translate signals between peripherals and host systems using the device’s numerous I/O pins and programmable fabric.
- Industrial Systems — Use in industrial electronics where the −40 °C to 100 °C operating range and surface-mount package meet rugged deployment requirements.
- Field-Upgradable Logic — Deploy reprogrammable logic that can be updated in the field to add features or fix issues without hardware replacement.
Unique Advantages
- Balanced Logic Density: 5,292 logic elements provide a mid-range integration point for combining control, glue logic and custom datapaths in a single device.
- On-Chip RAM for Local Storage: 57,344 bits of embedded RAM reduce external memory requirements for small buffers and state storage.
- High I/O Count: 146 I/O pins simplify board-level routing for systems that require multiple peripherals or parallel interfaces.
- Industrial Temperature Rating: Specified for −40 °C to 100 °C operation, supporting deployments in challenging temperature environments.
- Compact, Surface-Mount Package: The 208-BFQFP (208-PQFP, 28×28) package supports dense PCB layouts while remaining manufacturable with standard SMT processes.
- Regulatory-Friendly: RoHS compliance aligns with lead-free manufacturing and regulatory requirements.
Why Choose XC2S200E-6PQ208I?
The XC2S200E-6PQ208I positions itself as a practical, industrial-grade Spartan®-IIE FPGA option when designers need reprogrammable logic with moderate density, on-chip memory and a substantial I/O complement. Its combination of 5,292 logic elements, ~57 kbits of embedded RAM and 146 I/Os delivers a capable platform for embedded control, interface logic and prototype-to-production transitions.
For teams balancing PCB space, temperature resilience and RoHS requirements, this surface-mount FPGA in a 208-pin package offers a reliable, field-upgradable building block with family-level architectural capabilities documented in the datasheet.
Request a quote or submit a product inquiry to check availability and pricing for the XC2S200E-6PQ208I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








