XC2S200-6PQ208C

The XC2S200-6PQ208C is a Spartan®-II family FPGA from AMD packaged in a 208-BFQFP surface-mount package. It delivers a mid-range integration point with 5,292 logic elements, 140 user I/Os and on-chip memory, suited to commercial temperature applications.

Designed for board-level digital logic integration, the device provides a combination of configurable logic resources, embedded RAM and a substantial I/O count for system interfacing and custom digital functions.

Key Features

• Logic Capacity 5,292 logic elements providing the core programmable resources for implementing custom digital logic and control functions.
• Embedded Memory Approximately 0.057 Mbits (57,344 bits) of on-chip RAM for local buffering, state storage and small data structures.
• I/O Resources 140 general-purpose I/Os to support multiple interfaces, parallel buses and board-level connectivity requirements.
• Gate Count 200,000 gates enabling mid-size digital designs and system glue logic.
• Package & Mounting 208-BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for standard PCB assembly.
• Power Core supply voltage range of 2.375 V to 2.625 V to match targeted system power rails.
• Temperature & Grade Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Board-level digital control — Use the XC2S200-6PQ208C for custom digital controllers and glue-logic where 5,292 logic elements and on-chip RAM are sufficient for control and sequencing tasks.
• I/O interfacing and protocol bridging — The 140 user I/Os enable aggregation and translation between multiple peripheral interfaces on a single device.
• Prototyping and evaluation — Suitable for prototype systems that require reconfigurable logic with mid-range capacity and a commercial temperature envelope.

Unique Advantages

• Balanced logic and memory — 5,292 logic elements combined with 57,344 bits of on-chip RAM support a broad set of mid-size logic implementations without external memory for small buffers.
• High I/O count — 140 I/Os reduce the need for external I/O expanders and simplify board-level connectivity.
• Standard surface-mount packaging — 208-BFQFP (28×28 PQFP) enables conventional PCB assembly and compatibility with common manufacturing processes.
• Commercial temperature rating — Rated 0 °C to 85 °C for applications targeting commercial environments.
• RoHS compliant — Complies with RoHS requirements for environmentally conscious designs.

Why Choose XC2S200-6PQ208C?

The XC2S200-6PQ208C positions itself as a practical Spartan®-II FPGA option for designers needing moderate logic capacity, substantial I/O and on-chip memory within a commercial temperature range. Its combination of 5,292 logic elements, 140 I/Os and 57,344 bits of embedded RAM supports a variety of mid-range digital and interfacing tasks on standard PCB assemblies.

Manufactured by AMD and delivered in a 208-BFQFP surface-mount package with RoHS compliance, the device is suited for commercial applications where predictable specifications for voltage, temperature and packaging are required.

Request a quote or contact sales for pricing, lead times and availability of the XC2S200-6PQ208C.