XC2S200-6FG456C

The XC2S200-6FG456C is a Spartan®-II field programmable gate array (FPGA) IC from AMD packaged in a 456-ball BGA. It provides a mid-range integration point with measurable logic capacity, embedded RAM and a high pin-count I/O footprint for commercial applications.

Key attributes include 5,292 logic elements, approximately 57 Kbits of on-chip RAM, 284 I/Os and an estimated 200,000 gates, combined with a 2.375 V–2.625 V core supply and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Capacity  Provides 5,292 logic elements and 1,176 configurable logic blocks (CLBs) to implement custom digital functions and finite-state machines.
• Embedded Memory  Approximately 57,344 bits of on-chip RAM support local buffering, small FIFOs and lookup tables for control and data-path tasks.
• I/O Density  284 available I/O pins enable broad external interfacing options for peripherals, sensors and bus connections.
• Gate Count  An estimated 200,000 gates for mapping medium-complexity logic and glue functions within a single device.
• Package & Mounting  456-ball BGA package (listed as supplier device package 456-FBGA, 23×23) in a surface-mount form factor for compact board layouts.
• Power & Temperature  Core voltage supply range of 2.375 V to 2.625 V and commercial operating temperature from 0 °C to 85 °C for standard commercial deployments.
• Environmental  RoHS-compliant construction for regulatory alignment in commercial assemblies.

Typical Applications

• Commercial Embedded Systems  Use the XC2S200-6FG456C to implement custom control logic and peripheral interfaces in commercial-grade embedded products that operate within 0 °C to 85 °C.
• Prototyping and Development  Leverage the device’s logic and I/O resources to prototype medium-complexity digital designs before committing to production silicon or higher-density FPGAs.
• Glue Logic and System Integration  Deploy as a programmable glue-logic element to consolidate discrete components, implement bus bridging, or handle state machines and control tasks.
• Compact Board Designs  The 456-ball BGA surface-mount package supports dense PCB layouts where board area and I/O count are primary constraints.

Unique Advantages

• Balanced Logic and Memory:  A combination of 5,292 logic elements and approximately 57 Kbits of RAM enables both control and modest data-path implementations without external memory for small buffers.
• High I/O Count:  284 I/Os provide flexibility for interfacing to multiple peripherals, buses and external devices from a single device.
• Compact BGA Package:  456-ball BGA (456-FBGA, 23×23) allows for high-density PCB integration while keeping board space low.
• Commercial Temperature Rating:  Designed for 0 °C to 85 °C operation to meet typical commercial product requirements.
• RoHS Compliance:  Manufactured to meet RoHS standards for environmentally conscious designs.
• Predictable Power Envelope:  Specified core supply range (2.375 V–2.625 V) aids in power-supply design and system-level planning.

Why Choose XC2S200-6FG456C?

The XC2S200-6FG456C targets designers who need a commercially graded FPGA with a compelling balance of logic elements, embedded RAM and I/O capability in a compact BGA package. Its quantified resources — including 5,292 logic elements, roughly 57 Kbits of on-chip RAM and 284 I/Os — make it suitable for medium-complexity digital designs, control logic and integration roles where commercial temperature operation and RoHS compliance are required.

Choosing this Spartan®-II device delivers a predictable, field-programmable option from AMD for short- to mid-life-cycle products and development platforms where a known logic/gate count, clear supply-voltage requirement and high I/O count simplify system integration and BOM planning.

Request a quote or submit a pricing inquiry to receive current availability and lead-time information for XC2S200-6FG456C.