XC2S200-5PQG208C
| Part Description |
Spartan®-II Field Programmable Gate Array (FPGA) IC 140 57344 5292 208-BFQFP |
|---|---|
| Quantity | 989 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 140 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1176 | Number of Logic Elements/Cells | 5292 | ||
| Number of Gates | 200000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57344 |
Overview of XC2S200-5PQG208C – Spartan®-II FPGA, 208-BFQFP
The XC2S200-5PQG208C is a Spartan®-II Field Programmable Gate Array (FPGA) IC from AMD, offered in a 208-BFQFP package. It provides a balance of on-chip logic, embedded RAM, and flexible I/O suitable for commercial electronic designs that require customizable digital logic.
With 5,292 logic elements, approximately 57 Kbits of on-chip RAM and 140 I/O pins, this device targets applications that benefit from moderate gate density and configurable interfaces while maintaining a compact surface-mount package and commercial temperature rating.
Key Features
- Core Logic 5,292 logic elements (cells) enabling combinational and sequential logic implementation for custom digital functions.
- Embedded Memory Approximately 57 Kbits of total on-chip RAM for storage of state, buffering and small lookup tables.
- I/O Capacity 140 available I/O pins to support multiple parallel interfaces and peripheral connections in compact designs.
- Gate Count Approximately 200,000 equivalent gates for overall design complexity estimation and resource planning.
- Power Core voltage supply specified at 2.375 V to 2.625 V to match system power-rail requirements.
- Package & Mounting 208-BFQFP (supplier package: 208-PQFP, 28 × 28 mm) in a surface-mount form factor for PCB assembly.
- Temperature Rating Commercial operating temperature range of 0 °C to 85 °C for typical commercial-grade environments.
- Environmental Compliance RoHS compliant for regulatory and manufacturing considerations.
Typical Applications
- Custom digital logic and prototyping Implement and validate bespoke finite-state machines, glue logic and interface conversion in prototype and pilot designs.
- Embedded system control Offload timing-critical control functions and simple signal processing tasks within commercial embedded products.
- Peripheral and interface bridging Serve as a configurable bridge between different bus standards or peripheral devices using available I/O resources.
Unique Advantages
- Balanced resource mix: Combines 5,292 logic elements with approximately 57 Kbits of RAM and 140 I/O pins to address a wide range of commercial logic tasks without excessive board-level complexity.
- Compact surface-mount package: 208-BFQFP / 208-PQFP (28 × 28 mm) provides a space-efficient footprint for PCB designs with moderate routing density.
- Defined power rails: Narrow core voltage range (2.375–2.625 V) simplifies power-supply planning for consistent device operation.
- Commercial temperature suitability: Rated 0 °C to 85 °C to meet the environmental expectations of consumer and commercial electronic products.
- RoHS compliance: Supports environmental and manufacturing requirements for lead-free assembly.
- Recognized manufacturer: Produced by AMD, offering traceability and part consistency for production and procurement.
Why Choose XC2S200-5PQG208C?
The XC2S200-5PQG208C is positioned for engineers and teams seeking a commercially graded Spartan®-II FPGA that delivers a practical combination of logic density, embedded RAM and I/O in a compact surface-mount package. Its specification set supports a variety of commercial designs where configurable digital logic and interface flexibility are required without unnecessary overcapacity.
Designed and manufactured by AMD, this device provides a clear resource profile for evaluating fit in board-level designs, enabling straightforward selection for prototyping, product development and moderate-volume production runs within commercial temperature environments.
Request a quote or submit an inquiry to obtain pricing and availability for the XC2S200-5PQG208C and to discuss how it fits your next FPGA-based design.

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