XC2S200-5PQG208C

IC FPGA 140 I/O 208QFP
Part Description

Spartan®-II Field Programmable Gate Array (FPGA) IC 140 57344 5292 208-BFQFP

Quantity 989 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O140Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1176Number of Logic Elements/Cells5292
Number of Gates200000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits57344

Overview of XC2S200-5PQG208C – Spartan®-II FPGA, 208-BFQFP

The XC2S200-5PQG208C is a Spartan®-II Field Programmable Gate Array (FPGA) IC from AMD, offered in a 208-BFQFP package. It provides a balance of on-chip logic, embedded RAM, and flexible I/O suitable for commercial electronic designs that require customizable digital logic.

With 5,292 logic elements, approximately 57 Kbits of on-chip RAM and 140 I/O pins, this device targets applications that benefit from moderate gate density and configurable interfaces while maintaining a compact surface-mount package and commercial temperature rating.

Key Features

  • Core Logic  5,292 logic elements (cells) enabling combinational and sequential logic implementation for custom digital functions.
  • Embedded Memory  Approximately 57 Kbits of total on-chip RAM for storage of state, buffering and small lookup tables.
  • I/O Capacity  140 available I/O pins to support multiple parallel interfaces and peripheral connections in compact designs.
  • Gate Count  Approximately 200,000 equivalent gates for overall design complexity estimation and resource planning.
  • Power  Core voltage supply specified at 2.375 V to 2.625 V to match system power-rail requirements.
  • Package & Mounting  208-BFQFP (supplier package: 208-PQFP, 28 × 28 mm) in a surface-mount form factor for PCB assembly.
  • Temperature Rating  Commercial operating temperature range of 0 °C to 85 °C for typical commercial-grade environments.
  • Environmental Compliance  RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

  • Custom digital logic and prototyping  Implement and validate bespoke finite-state machines, glue logic and interface conversion in prototype and pilot designs.
  • Embedded system control  Offload timing-critical control functions and simple signal processing tasks within commercial embedded products.
  • Peripheral and interface bridging  Serve as a configurable bridge between different bus standards or peripheral devices using available I/O resources.

Unique Advantages

  • Balanced resource mix: Combines 5,292 logic elements with approximately 57 Kbits of RAM and 140 I/O pins to address a wide range of commercial logic tasks without excessive board-level complexity.
  • Compact surface-mount package: 208-BFQFP / 208-PQFP (28 × 28 mm) provides a space-efficient footprint for PCB designs with moderate routing density.
  • Defined power rails: Narrow core voltage range (2.375–2.625 V) simplifies power-supply planning for consistent device operation.
  • Commercial temperature suitability: Rated 0 °C to 85 °C to meet the environmental expectations of consumer and commercial electronic products.
  • RoHS compliance: Supports environmental and manufacturing requirements for lead-free assembly.
  • Recognized manufacturer: Produced by AMD, offering traceability and part consistency for production and procurement.

Why Choose XC2S200-5PQG208C?

The XC2S200-5PQG208C is positioned for engineers and teams seeking a commercially graded Spartan®-II FPGA that delivers a practical combination of logic density, embedded RAM and I/O in a compact surface-mount package. Its specification set supports a variety of commercial designs where configurable digital logic and interface flexibility are required without unnecessary overcapacity.

Designed and manufactured by AMD, this device provides a clear resource profile for evaluating fit in board-level designs, enabling straightforward selection for prototyping, product development and moderate-volume production runs within commercial temperature environments.

Request a quote or submit an inquiry to obtain pricing and availability for the XC2S200-5PQG208C and to discuss how it fits your next FPGA-based design.

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