XC2S200-5FGG456I

The XC2S200-5FGG456I is a Spartan®-II Field Programmable Gate Array from AMD. It delivers a mid-range FPGA resource set in a compact 456-ball BGA package for industrial-grade applications.

Key device attributes include 1,176 CLBs, 5,292 logic elements, approximately 57 kbits of on-chip RAM, 284 I/O pins, and a supply voltage range of 2.375 V to 2.625 V. The device is rated for surface-mount assembly and operates from −40 °C to 100 °C.

Key Features

• Core Logic 1,176 CLBs and 5,292 logic elements provide the programmable logic fabric for implementing custom digital functions, supporting designs up to 200,000 gates.
• Embedded Memory Approximately 57,344 bits (≈57 kbits) of on-chip RAM for data buffering, state machines, and small memory structures.
• I/O Capacity 284 general-purpose I/O pins enable wide interfacing options for peripheral connections and system-level integration.
• Package & Mounting 456-ball BGA (supplier package: 456-FBGA, 23×23) in a surface-mount form factor for compact PCB layouts.
• Power Supported core supply range from 2.375 V to 2.625 V to match system power rails.
• Temperature & Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C suitable for thermally demanding environments.
• Regulatory RoHS compliant.

Typical Applications

• Custom digital logic and prototyping Implements medium-complexity programmable logic functions using 5,292 logic elements and 1,176 CLBs for design validation and system-specific acceleration.
• I/O-intensive system integration Supports interface consolidation and glue logic with up to 284 I/O pins in a compact BGA package.
• Industrial control and automation Industrial-grade temperature range (−40 °C to 100 °C) and robust packaging make the device suitable for factory and process-control environments.

Unique Advantages

• Balanced logic capacity: 5,292 logic elements and 1,176 CLBs offer a practical mid-range resource set for many custom digital designs without unnecessary overhead.
• On-chip memory resources: Approximately 57 kbits of embedded RAM reduce the need for external memory for small buffers and state storage.
• High I/O count: 284 I/O pins facilitate complex interfacing and reduce external multiplexing or bridging components.
• Industrial operating range: Rated from −40 °C to 100 °C for deployment in temperature-challenging applications.
• Compact BGA packaging: 456-ball BGA (23×23) enables high-density PCB layouts while maintaining surface-mount assembly compatibility.
• RoHS compliant: Meets common lead-free manufacturing and environmental requirements.

Why Choose XC2S200-5FGG456I?

The XC2S200-5FGG456I positions itself as a mid-range Spartan®-II FPGA option that combines a practical logic element count, meaningful embedded RAM, and a high I/O complement in a compact 456-BBGA package. Its industrial temperature rating and RoHS compliance make it a reliable choice for designs that require consistent operation across a wide thermal range.

This device is well suited for engineers and procurement teams seeking a programmable logic solution with balanced resources for custom logic implementation, I/O consolidation, and industrial applications, delivered by AMD's Spartan®-II FPGA family.

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