XC2S200-5FGG256C

The XC2S200-5FGG256C is an AMD Spartan®-II field programmable gate array presented in a 256-BGA package. It provides a mid-range logic resource set and on-chip memory suitable for commercial embedded and digital designs.

With thousands of logic elements, tens of kilobits of embedded RAM and a substantial I/O count, this surface-mount FPGA is aimed at applications that require flexible, reconfigurable logic in a compact package while operating within commercial temperature limits.

Key Features

• Core Logic Approximately 5,292 logic elements and 1,176 configurable logic blocks (CLBs), corresponding to a total gate count of 200,000 for implementing custom digital functions.
• Embedded Memory Approximately 57,344 bits of on-chip RAM for small buffers, FIFOs and local data storage.
• I/O Capacity 176 user I/O pins provide flexible external interfacing for peripherals and buses.
• Power Supply Operates from a supply voltage range of 2.375 V to 2.625 V.
• Package & Mounting 256-BGA package (supplier device package: 256-FBGA 17×17), intended for surface-mount assembly in space-constrained designs.
• Operating Range & Compliance Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Embedded Control & Prototyping Implement custom control logic and prototype digital systems using approximately 5,292 logic elements and 176 I/O.
• Interface Bridging and Glue Logic Bridge between peripherals and buses or implement glue logic leveraging the device's I/O count and 200,000-gate capacity.
• Small On-Chip Buffering Use the ~57,344 bits of embedded RAM for FIFOs, small buffers or localized data storage within FPGA-based designs.

Unique Advantages

• Mid-Range Logic Density: Offers roughly 5,292 logic elements for projects that need significant but contained programmable logic resources.
• Generous I/O Count: 176 I/O pins enable integration with multiple peripherals and interfaces without external multiplexing.
• On-Chip Memory: Approximately 57,344 bits of embedded RAM reduce external memory dependency for modest buffering and state retention.
• Compact, Board-Level Package: 256-BGA (256-FBGA 17×17) supports high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Commercial Temperature & RoHS Compliance: Commercial-grade operating range (0 °C to 85 °C) and RoHS compliance align with standard electronic product requirements.

Why Choose XC2S200-5FGG256C?

The XC2S200-5FGG256C positions itself as a practical Spartan®-II FPGA option for designers seeking a balance of logic capacity, embedded memory and I/O in a compact 256-BGA footprint. Its specifications—including roughly 5,292 logic elements, ~57,344 bits of on-chip RAM, 176 I/O and a 200,000-gate estimate—make it suitable for commercial embedded and digital designs where reconfigurable logic and moderate integration are required.

Manufactured by AMD and provided in a surface-mount package with defined voltage and temperature ranges, this FPGA is a straightforward choice for teams planning board-level integration that requires reprogrammable logic resources and compliance with RoHS requirements.

Request a quote or submit an inquiry for pricing and availability of the XC2S200-5FGG256C to begin your procurement process.