XC2S200-5FGG256I

The XC2S200-5FGG256I is a Spartan®-II field programmable gate array (FPGA) from AMD, supplied in a 256-ball BGA package. It provides a mid-range programmable logic resource set including 5,292 logic elements, approximately 57 kbits of embedded RAM, and 176 user I/O pins for flexible system integration.

Designed for industrial environments, this device supports a wide operating temperature range and a defined core voltage window, making it suitable for embedded designs that require configurable logic, moderate on-chip memory, and extensive I/O connectivity.

Key Features

• Core Logic 5,292 logic elements with 1,176 logic blocks (CLBs) and an estimated 200,000 logic-equivalent gates to implement custom digital functions.
• On-chip Memory Approximately 57 kbits of total RAM bits for embedded buffering, small FIFOs, and state storage.
• I/O and System Interfaces 176 user I/O pins provide broad connectivity options for interfacing with peripherals, sensors, and external logic.
• Power Specified core supply voltage range of 2.375 V to 2.625 V for predictable power planning and system design.
• Package 256-ball BGA (256-FBGA, 17 × 17) package for compact board footprint and reliable soldered connections.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control — Use the device to implement control logic and interface functions where extended temperature range and multiple I/O are required.
• Embedded Systems — Implement custom glue logic, peripheral controllers, and modest data-path functions using the available logic elements and on-chip RAM.
• Prototyping and Development — Validate and iterate hardware designs that need reprogrammable logic capacity and a compact BGA footprint.

Unique Advantages

• Balanced Logic Capacity: 5,292 logic elements and 1,176 CLBs provide sufficient resources for moderate-complexity designs without excessive overprovisioning.
• Integrated Local Memory: Approximately 57 kbits of embedded RAM supports small buffering and state retention without external memory.
• High I/O Count: 176 user I/Os enable multiple peripheral interfaces and flexible board-level partitioning.
• Industrial Viability: −40 °C to 100 °C operating range and industrial grade classification suit deployment in demanding environments.
• Compact Packaging: 256-FBGA (17×17) package minimizes PCB area while maintaining robust solder connections for production assemblies.
• Standards Compliance: RoHS compliance supports restricted-substance requirements in manufacturing.

Why Choose XC2S200-5FGG256I?

The XC2S200-5FGG256I positions itself as a practical, industrial-grade Spartan®-II FPGA option for designers who need a reliable mix of programmable logic, on-chip RAM, and a high I/O count in a compact BGA package. Its specified voltage range and extended temperature rating make it appropriate for embedded and industrial applications that require consistent electrical and thermal performance.

This device suits engineers and procurement teams looking for a mid-range FPGA to implement custom logic, interface glue, and modest memory-backed functions while maintaining a small PCB footprint and RoHS compliance.

Request a quote today to check pricing and availability for the XC2S200-5FGG256I and to discuss how it can fit into your next design.