XC2S200-5FGG456C

The XC2S200-5FGG456C is a Spartan®-II field programmable gate array (FPGA) from AMD, delivered in a 456-ball BGA surface-mount package. It provides a configurable logic resource tailored for commercial electronic designs that require moderate logic capacity, on-chip memory, and high I/O count.

This device combines 5,292 logic elements, approximately 0.057 Mbits of embedded memory, and 284 I/O pins in a compact 456-FBGA (23×23) package. It operates from a 2.375 V to 2.625 V supply and is specified for commercial temperature operation (0 °C to 85 °C). The part is RoHS compliant.

Key Features

• Core Logic  5,292 logic elements and approximately 200,000 gates provide flexible capacity for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 0.057 Mbits (57,344 bits) of on-chip RAM supports data buffering, state machines, and small lookup tables without external memory.
• I/O and Interfacing  284 programmable I/O pins enable dense external connectivity for peripherals, buses, and interface bridging.
• Package and Mounting  456-BBGA (supplier package 456-FBGA, 23×23) surface-mount package delivers a compact footprint suitable for space-constrained PCBs.
• Power  Single-supply operation in the range 2.375 V to 2.625 V simplifies power-rail design for compatible commercial systems.
• Environmental and Grade  Commercial grade operation with a specified ambient temperature range of 0 °C to 85 °C and RoHS compliance for environmental requirements.

Typical Applications

• Commercial Embedded Systems  Implement custom logic, protocol handling, and real-time control tasks within commercial equipment operating in standard environments.
• Interface and Glue Logic  Provide pin-rich programmable interfacing and bus adaptation between disparate components and sub-systems.
• Prototyping and Development  Use as a configurable platform for development and evaluation of digital functions prior to final system integration.

Unique Advantages

• Balanced Logic Density:  5,292 logic elements and ~200,000 gates support substantive custom designs without requiring larger FPGAs.
• On-Chip Memory Availability:  Approximately 0.057 Mbits of embedded RAM reduces dependence on external memory for small data buffering and state storage.
• High I/O Count:  284 I/O pins enable broad connectivity for sensors, peripherals, and multiple interfaces from a single device.
• Compact BGA Packaging:  The 456-BBGA (23×23) package allows high pin density in a space-efficient footprint for PCB-constrained designs.
• Commercial Temperature Rating:  Rated for 0 °C to 85 °C operation, suitable for standard commercial applications and environments.
• RoHS Compliant:  Meets RoHS environmental requirements for lead-free assembly and compliance needs.

Why Choose XC2S200-5FGG456C?

The XC2S200-5FGG456C delivers a pragmatic mix of logic capacity, embedded memory, and high I/O in a compact 456-ball BGA package, suited to commercial designs that need configurable logic and dense connectivity. Its supply voltage range and commercial temperature rating make it appropriate for a wide range of standard electronic products.

This FPGA is a solid choice for engineers and procurement teams seeking a documented Spartan®-II family device with adequate on-chip resources for glue logic, protocol handling, and mid-range custom digital implementations while maintaining a compact board footprint and RoHS compliance.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the XC2S200-5FGG456C.