XC2S200-5FG456C

The XC2S200-5FG456C is an AMD Spartan®-II field programmable gate array supplied in a 456-ball BGA package. This commercial-grade FPGA provides a balance of programmable logic capacity, on-chip RAM, and I/O density for a range of commercial digital designs.

With 5,292 logic elements, 57,344 bits of embedded RAM (approximately 0.057 Mbits), and 284 I/O pins, the device targets designers who need a mid-range FPGA solution that fits 23 × 23 456-ball FBGA footprints and operates within standard commercial power and temperature envelopes.

Key Features

• Programmable Logic — 5,292 logic elements enable implementation of custom digital functions and moderate-density logic designs.
• On‑Chip Memory — 57,344 bits of embedded RAM (approximately 0.057 Mbits) provide local storage for buffering, small lookup tables, or state machines.
• Gate Count — Approximately 200,000 gates for estimating overall design capacity and resource partitioning.
• I/O Density — 284 user I/O pins support multiple parallel interfaces or mixed I/O requirements in a single device.
• Power Requirements — Core supply range 2.375 V to 2.625 V for compatibility with common FPGA power rails.
• Package and Mounting — 456‑BBGA package (supplier package: 456‑FBGA, 23×23) designed for surface-mount assembly.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for typical commercial environments.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• Custom Digital Logic — Implement application-specific logic and glue functions where 5,292 logic elements and ~284 I/O are sufficient.
• I/O-Intensive Interfaces — Support multiple parallel or mixed-signal interfaces using the device's 284 available I/O pins.
• On‑Chip Buffering and Control — Use embedded RAM for small buffering, FIFOs, or control-state storage within control and data-path designs.

Unique Advantages

• Balanced Logic Capacity: 5,292 logic elements and ~200,000 gates provide a clear sizing point for moderate-complexity designs without over-provisioning.
• High I/O Count: 284 I/O pins allow consolidation of multiple interfaces onto a single device, reducing board complexity.
• Compact BGA Footprint: 456-ball BGA (23×23) packaging supports dense PCB layouts with surface-mount assembly.
• Defined Power Envelope: Core voltage range of 2.375 V to 2.625 V simplifies power supply selection and design planning.
• Commercial Temperature Rating: 0 °C to 85 °C rating aligns with standard commercial deployments and lifecycle planning.
• RoHS Compliant: Meets lead-free and hazardous-material restrictions for environmental compliance.

Why Choose XC2S200-5FG456C?

The XC2S200-5FG456C positions itself as a mid-range Spartan®-II FPGA option for commercial designers who require a measured combination of logic density, on-chip RAM, and substantial I/O in a compact BGA package. Its specification set — including 5,292 logic elements, 57,344 bits of embedded RAM, 284 I/O, and a clearly defined core voltage and temperature range — makes it suitable for board-level designs that prioritize integration and predictable electrical and thermal behavior.

This device is appropriate for teams looking to balance resource needs and board space while maintaining compliance with RoHS requirements and standard commercial operating conditions. Its package and pin count support consolidation of interface logic and moderate buffering needs in a single programmable device.

If you would like pricing, availability, or to submit a quote request for the XC2S200-5FG456C, please request a quote or contact our sales team to get started.