XC2S150E-6FT256I

The XC2S150E-6FT256I is a Spartan®-IIE Field Programmable Gate Array (FPGA) manufactured by AMD, offered in a 256-ball BGA package. It provides a mid-range FPGA fabric with 3,888 logic elements, approximately 49,152 bits of on-chip RAM, and 182 general-purpose I/O pins for system-level integration.

Designed for industrial-grade operation, this device supports reprogrammability and a feature set intended for cost-sensitive designs that require configurable logic, embedded memory, and flexible I/O. The device operates from 1.71 V to 1.89 V and is specified for -40 °C to 100 °C.

Key Features

• Core Logic — Contains 3,888 logic elements and an internal architecture that maps to approximately 150,000 system gates, suitable for medium-complexity programmable logic functions.
• Embedded Memory — Approximately 49,152 bits of total on-chip RAM to support data buffering, FIFOs, and small local storage needs within the FPGA fabric.
• I/O Resources — 182 I/O pins to support a wide range of external interfaces and board-level connections.
• Clock Management — Family-level architecture includes dedicated Delay-Locked Loops (DLLs) for advanced clock control and predictable timing (documented in the Spartan®-IIE family data sheet).
• Package & Mounting — 256-ball LBGA surface-mount package (supplier device package listed as 256-FTBGA, 17×17) for compact board layouts.
• Power & Operating Range — Core supply range of 1.71 V to 1.89 V and an industrial operating temperature range of -40 °C to 100 °C.
• RoHS Compliant — Device meets RoHS environmental compliance requirements as provided in the product data.

Typical Applications

• ASIC Replacement and Prototyping — Implement custom logic and iterate designs in-system without the nonrecurring costs of mask-programmed ASICs.
• Industrial Control — Use the industrial temperature rating and flexible I/O to implement motor control logic, protocol bridging, or machine interface functions.
• Embedded System Glue Logic — Integrate multiple peripheral interfaces and custom state machines using available logic elements and on-chip RAM.
• Field Upgradable Designs — Leverage FPGA reprogrammability for deployed systems that require post-deployment updates or feature additions.

Unique Advantages

• Balanced Integration: Combines a mid-range logic capacity (3,888 logic elements) with on-chip RAM and substantial I/O to reduce external component count.
• Industrial Temperature Rating: Specified operation from -40 °C to 100 °C enables deployment in harsh or wide-temperature environments.
• Compact Package: 256-ball LBGA (256-FTBGA, 17×17) enables dense board layouts while keeping routing manageable for mid-complexity designs.
• Predictable Timing Control: Family-level clock-management features (DLLs) support deterministic clocking strategies for synchronous designs.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC2S150E-6FT256I?

The XC2S150E-6FT256I positions itself as a flexible, industrial-grade FPGA option for engineers needing a reprogrammable, mid-density logic device with integrated memory and broad I/O. Its combination of 3,888 logic elements, approximately 49,152 bits of embedded RAM, and 182 I/Os enables compact, maintainable designs that can be updated in the field.

This device is well suited for teams replacing prototype ASICs, implementing industrial controls, or consolidating discrete logic into a single programmable device. The specified voltage and temperature ranges, along with RoHS compliance, support long-term deployment and manufacturing consistency.

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