XC2S150-6FGG256C

The XC2S150-6FGG256C is a Spartan®-II field programmable gate array (FPGA) in a 256-ball BGA package, optimized for commercial electronic designs requiring on-chip logic and embedded memory. With 3,888 logic elements and approximately 49,152 bits of embedded RAM, it delivers a balance of programmable capacity and I/O density for a wide range of configurable digital tasks.

Supplied in a surface-mount 256-FBGA (17×17) package and rated for commercial temperature operation (0 °C to 85 °C), this FPGA supports designs that require moderate gate count, flexible I/O, and a defined core supply voltage range of 2.375 V to 2.625 V.

Key Features

• Core Logic Contains 3,888 logic elements to implement custom combinational and sequential logic functions.
• Embedded Memory Approximately 49,152 bits of on-chip RAM for small data buffers, FIFOs, and scratchpad storage.
• I/O Capacity 176 user I/O pins enabling multiple peripheral interfaces and custom signal routing.
• Gate Density Equivalent to 150,000 gates for integrating moderate-complexity digital functions.
• Package and Mounting 256-ball FBGA (17×17) package in a surface-mount form factor for compact board integration.
• Power and Voltage Core supply voltage range of 2.375 V to 2.625 V to match system power rails.
• Operating Range Commercial temperature grade with specified operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for reduced hazardous substances in assembly.

Typical Applications

• Commercial Embedded Systems Deploy custom logic and control functions where moderate logic density and up to 176 I/O are required.
• Prototyping and Development Validate digital designs and proof-of-concept implementations using on-chip RAM and reprogrammable logic capacity.
• Custom I/O and Glue Logic Bridge multiple peripherals and implement protocol adaptation leveraging the device’s I/O count and programmable resources.

Unique Advantages

• Balanced Logic and Memory: 3,888 logic elements paired with approximately 49,152 bits of embedded RAM provide a compact solution for combined control and data buffering tasks.
• High I/O Density: 176 user I/O pins enable flexible interfacing to sensors, peripherals, and external devices without large external glue logic.
• Compact Surface-Mount Package: The 256-FBGA (17×17) package supports space-constrained board layouts while maintaining connectivity and thermal characteristics suitable for commercial designs.
• Defined Power Envelope: A narrow core voltage window (2.375 V–2.625 V) simplifies power supply design and integration into existing commercial power architectures.
• Regulatory-Friendly Assembly: RoHS compliance simplifies supply chain and regulatory considerations for commercial product builds.

Why Choose XC2S150-6FGG256C?

The XC2S150-6FGG256C positions itself as a practical commercial-grade FPGA for designers seeking moderate logic density, ample I/O, and on-chip memory in a compact BGA package. Its combination of 3,888 logic elements, approximately 49,152 bits of embedded RAM, and 176 I/O pins makes it well suited for configurable control, interface, and prototyping applications where board space and reprogrammability are priorities.

For teams and projects that require predictable power requirements and commercial temperature operation, this Spartan®-II device offers a reliable, RoHS-compliant building block backed by a clear set of hardware specifications for straightforward integration into production designs.

Request a quote or submit a purchase inquiry to get pricing and availability for the XC2S150-6FGG256C and streamline procurement for your next design.