XC2S150-5PQG208I

The XC2S150-5PQG208I is a Spartan®-II field-programmable gate array (FPGA) from AMD, delivered in a 208-BFQFP surface-mount package. It integrates 3,888 logic elements and approximately 49,152 bits of on-chip RAM to support custom digital logic, interface bridging, and I/O expansion within industrial temperature ranges.

Designed for applications that require moderate logic density, significant I/O count, and operation across −40 °C to 100 °C, this device combines a compact package with a 140-pin I/O complement and a 2.375 V–2.625 V core supply window.

Key Features

• Core Logic  3,888 logic elements available for implementing custom digital functions and state machines.
• Configurable Logic Blocks (CLBs)  864 CLBs to structure and allocate logic resources efficiently across the design.
• Embedded Memory  Approximately 0.049 Mbits (49,152 bits) of on-chip RAM for buffer, FIFO, and small lookup table storage.
• I/O Capacity  140 general-purpose I/O pins provide broad interfacing options for peripherals, buses, and sensors.
• Gate Count  Approximately 150,000 gates for implementing moderately complex logic and glue functions.
• Package & Mounting  208-BFQFP surface-mount package (supplier device package: 208-PQFP, 28×28) for dense PCB integration.
• Power Supply  Core operating voltage range of 2.375 V to 2.625 V to match system power architectures.
• Industrial Temperature Range  Specified operation from −40 °C to 100 °C for reliable performance in extended-temperature environments.
• RoHS Compliant  Environmentally compliant manufacturing and materials.

Typical Applications

• Industrial Control  Implement custom control logic and I/O aggregation while maintaining operation across −40 °C to 100 °C.
• Embedded System Glue Logic  Bridge and adapt interfaces between processors, peripherals, and custom modules using available logic elements and 140 I/O pins.
• Communications and Interface  Implement protocol translation, data buffering, and custom serialization with on-chip RAM and abundant I/O.
• Prototyping and Small FPGA Designs  Validate and iterate digital designs that require a moderate number of gates and logic elements in a compact package.

Unique Advantages

• Balanced Logic and Memory  3,888 logic elements paired with approximately 0.049 Mbits of RAM enable a mix of combinational and storage functions without external memory.
• High I/O Count in a Compact Package  140 I/O pins in a 208-BFQFP footprint support multiple peripheral connections while conserving PCB area.
• Industrial Temperature Capability  Rated from −40 °C to 100 °C to meet requirements for extended-temperature deployments.
• Vendor-backed Component  Manufactured by AMD, providing consistent device identity and supply traceability.
• Surface-Mount Integration  208-BFQFP surface-mount package simplifies automated PCB assembly and yields a low-profile system solution.

Why Choose XC2S150-5PQG208I?

The XC2S150-5PQG208I positions itself as a practical FPGA choice for designs that demand a moderate mix of logic, embedded RAM, and a high I/O count in a compact surface-mount package. Its industrial temperature rating and defined supply window make it appropriate for systems that require reliable operation across a wide temperature range.

Choose this AMD Spartan®-II device when your design needs deterministic logic resources (3,888 logic elements), substantial I/O (140 pins), and on-chip memory (approximately 49,152 bits) in a 208-BFQFP package for robust, board-level integration.

Request a quote or submit an RFQ today to check availability and pricing for the XC2S150-5PQG208I.