XC2S150-6FG456C

The XC2S150-6FG456C is a Spartan®-II Field Programmable Gate Array (FPGA) offering programmable digital logic in a compact 456-ball BGA package. It provides 3,888 logic elements and 49,152 bits of on-chip RAM, combined with 260 user I/O pins and an estimated 150,000 gates for implementing custom digital functions.

Designed for commercial-grade applications, this surface-mount FPGA operates from a core supply of 2.375 V to 2.625 V and supports an ambient operating range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity — 3,888 logic elements for implementing combinational and sequential logic across a variety of digital designs.
• Embedded Memory — 49,152 bits of on-chip RAM to support buffers, small FIFOs, and scratchpad storage within user logic.
• I/O Density — 260 user I/O pins to connect multiple peripherals, buses, and external devices directly to the FPGA fabric.
• Gate Scale — Approximately 150,000 gates of logic resource for medium-complexity designs.
• Power Supply — Core supply range of 2.375 V to 2.625 V to match system power rails and design constraints.
• Package & Mounting — 456-ball BGA package (supplier package listed as 456-FBGA, 23 × 23) in a surface-mount form factor for compact board implementations.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for standard commercial environments.
• Environmental Compliance — RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• Custom digital logic and prototyping: Implement glue logic, state machines, and custom accelerators using the device’s logic elements and on-chip RAM.
• I/O expansion and protocol bridging: Use the 260 I/O pins to interface multiple serial/parallel peripherals or to create protocol converters.
• Buffering and small-data storage: Leverage the 49,152 bits of embedded RAM for buffering, small FIFOs, and temporary data storage within processing pipelines.
• Control and interface logic for commercial electronics: Integrate application-specific control, sequencing, and signal management in compact, surface-mount designs.

Unique Advantages

• Balanced logic and memory resources: 3,888 logic elements alongside 49,152 bits of RAM provide a practical combination for medium-complexity FPGA tasks without external memory in many cases.
• High I/O count in a compact package: 260 user I/Os in a 456-ball BGA enable dense connectivity while preserving board area.
• Commercial temperature suitability: Rated 0 °C to 85 °C, the device is appropriate for standard commercial applications and environments.
• Surface-mount BGA packaging: The 456-ball BGA (23 × 23) offers a manufacturable form factor for modern SMT assembly processes.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing requirements.

Why Choose XC2S150-6FG456C?

The XC2S150-6FG456C provides a well-balanced FPGA solution for designers seeking moderate logic capacity, on-chip RAM, and extensive I/O in a compact surface-mount BGA package. Its combination of 3,888 logic elements, 49,152 bits of embedded memory, and 260 I/O pins makes it suitable for custom digital logic, protocol bridging, and control/interface tasks in commercial electronic products.

With a defined operating voltage range and commercial temperature rating, this Spartan®-II FPGA is positioned for projects that require predictable electrical and environmental characteristics, along with RoHS compliance for contemporary manufacturing workflows.

Request a quote or submit a purchasing inquiry to obtain pricing and availability for the XC2S150-6FG456C.