XC2S150-6FG256C
| Part Description |
Spartan®-II Field Programmable Gate Array (FPGA) IC 176 49152 3888 256-BGA |
|---|---|
| Quantity | 75 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 864 | Number of Logic Elements/Cells | 3888 | ||
| Number of Gates | 150000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of XC2S150-6FG256C – Spartan®-II Field Programmable Gate Array (FPGA) IC 176 49152 3888 256-BGA
The XC2S150-6FG256C is a Spartan®-II field programmable gate array (FPGA) providing programmable logic resources and on-chip memory in a compact surface-mount BGA package. It combines approximately 3,888 logic elements and embedded RAM with 176 user I/O pins to address moderate-density programmable logic requirements.
Engineered for commercial-temperature applications, the device operates from a 2.375 V to 2.625 V supply and is RoHS compliant, offering a balance of integration and form factor for board-level FPGA implementations.
Key Features
- Logic Capacity Approximately 3,888 logic elements and about 150,000 gates provide the core programmable resources for implementing combinational and sequential logic.
- Embedded Memory Approximately 0.049 Mbits of on-chip RAM (49,152 bits) for data buffering, small FIFOs, and state storage.
- I/O Resources 176 user I/O pins to interface with peripherals, sensors, and external logic at the board level.
- Package and Mounting 256-ball BGA (supplier package: 256-FBGA, 17 × 17 mm) in a surface-mount form factor for compact PCB integration.
- Power Single VCC_CORE supply range from 2.375 V to 2.625 V for core operation.
- Temperature and Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant, supporting regulatory requirements for lead-free assemblies.
Unique Advantages
- Balanced Logic Density: Approximately 3,888 logic elements and ~150,000 gates deliver a mid-range resource set for implementing a variety of digital functions without excessive board-level complexity.
- On-Chip Memory for Local Storage: 49,152 bits of embedded RAM enable local buffering and state retention without immediate need for external memory.
- Ample I/O Count: 176 I/O pins provide flexible interfacing options for mixed-signal front ends, control signals, or parallel data buses.
- Compact BGA Package: The 256-FBGA (17 × 17 mm) package supports high-density board layouts while maintaining surface-mount assembly compatibility.
- Commercial Temperature Operation: Rated for 0 °C to 85 °C, suitable for standard commercial electronics and environments within that range.
- Lead-Free Manufacturing Support: RoHS compliance simplifies integration into lead-free production workflows.
Why Choose XC2S150-6FG256C?
The XC2S150-6FG256C positions itself as a practical Spartan®-II FPGA option for designs that require a moderate amount of programmable logic, embedded RAM, and a substantial I/O complement in a compact BGA package. Its electrical and thermal ratings are aligned with commercial-grade applications, and the RoHS compliance supports modern assembly requirements.
Designers and buyers looking for a surface-mount FPGA with defined logic capacity, on-chip memory, and broad I/O can leverage the XC2S150-6FG256C for board-level implementations that prioritize integration and predictable supply/temperature ranges.
Request a quote or submit a purchase inquiry to receive pricing and availability for the XC2S150-6FG256C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








