XC2S150-6FG256C

IC FPGA 176 I/O 256FBGA
Part Description

Spartan®-II Field Programmable Gate Array (FPGA) IC 176 49152 3888 256-BGA

Quantity 75 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs864Number of Logic Elements/Cells3888
Number of Gates150000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of XC2S150-6FG256C – Spartan®-II Field Programmable Gate Array (FPGA) IC 176 49152 3888 256-BGA

The XC2S150-6FG256C is a Spartan®-II field programmable gate array (FPGA) providing programmable logic resources and on-chip memory in a compact surface-mount BGA package. It combines approximately 3,888 logic elements and embedded RAM with 176 user I/O pins to address moderate-density programmable logic requirements.

Engineered for commercial-temperature applications, the device operates from a 2.375 V to 2.625 V supply and is RoHS compliant, offering a balance of integration and form factor for board-level FPGA implementations.

Key Features

  • Logic Capacity  Approximately 3,888 logic elements and about 150,000 gates provide the core programmable resources for implementing combinational and sequential logic.
  • Embedded Memory  Approximately 0.049 Mbits of on-chip RAM (49,152 bits) for data buffering, small FIFOs, and state storage.
  • I/O Resources  176 user I/O pins to interface with peripherals, sensors, and external logic at the board level.
  • Package and Mounting  256-ball BGA (supplier package: 256-FBGA, 17 × 17 mm) in a surface-mount form factor for compact PCB integration.
  • Power  Single VCC_CORE supply range from 2.375 V to 2.625 V for core operation.
  • Temperature and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Unique Advantages

  • Balanced Logic Density: Approximately 3,888 logic elements and ~150,000 gates deliver a mid-range resource set for implementing a variety of digital functions without excessive board-level complexity.
  • On-Chip Memory for Local Storage: 49,152 bits of embedded RAM enable local buffering and state retention without immediate need for external memory.
  • Ample I/O Count: 176 I/O pins provide flexible interfacing options for mixed-signal front ends, control signals, or parallel data buses.
  • Compact BGA Package: The 256-FBGA (17 × 17 mm) package supports high-density board layouts while maintaining surface-mount assembly compatibility.
  • Commercial Temperature Operation: Rated for 0 °C to 85 °C, suitable for standard commercial electronics and environments within that range.
  • Lead-Free Manufacturing Support: RoHS compliance simplifies integration into lead-free production workflows.

Why Choose XC2S150-6FG256C?

The XC2S150-6FG256C positions itself as a practical Spartan®-II FPGA option for designs that require a moderate amount of programmable logic, embedded RAM, and a substantial I/O complement in a compact BGA package. Its electrical and thermal ratings are aligned with commercial-grade applications, and the RoHS compliance supports modern assembly requirements.

Designers and buyers looking for a surface-mount FPGA with defined logic capacity, on-chip memory, and broad I/O can leverage the XC2S150-6FG256C for board-level implementations that prioritize integration and predictable supply/temperature ranges.

Request a quote or submit a purchase inquiry to receive pricing and availability for the XC2S150-6FG256C.

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