XC2S150-6FGG456C

The XC2S150-6FGG456C is a Spartan®-II Field Programmable Gate Array (FPGA) IC designed for commercial embedded designs requiring mid-range logic capacity and flexible I/O. It provides a balance of on-chip memory, logic resources and I/O density in a surface-mount BGA package suitable for compact board-level integration.

With 3,888 logic elements, approximately 49,152 bits of embedded memory and 260 available I/Os, this device targets commercial applications that need programmable logic, system integration and moderate on-chip storage while meeting RoHS requirements.

Key Features

• Core Logic Capacity — 3,888 logic elements and approximately 150,000 equivalent gates for mid-range programmable logic integration.
• Embedded Memory — Approximately 49,152 bits (≈0.049 Mbits) of on-chip RAM for buffering, state storage and small data tables.
• I/O Resources — 260 I/O pins to support multiple interfaces, signal routing and external peripheral connections.
• Package and Mounting — 456-ball BGA (456-BBGA; supplier package: 456-FBGA 23×23) in a surface-mount form factor for compact PCB layouts.
• Power — Core voltage supply range of 2.375 V to 2.625 V for stable operation within specified supply limits.
• Operating Range — Commercial temperature rating from 0 °C to 85 °C suitable for consumer and commercial embedded environments.
• Regulatory — RoHS compliant for adherence to current environmental directives.

Typical Applications

• Commercial Embedded Systems — Implement control logic, glue logic and custom peripheral interfaces using the device's 3,888 logic elements and 260 I/Os.
• Prototyping and Development — Rapidly evaluate and iterate digital designs that require moderate on-chip RAM and reprogrammable logic capacity.
• Communication Interfaces — Bridge and manage multiple digital interfaces with abundant I/O and on-chip memory for transient buffering.
• Consumer Electronics — Integrate custom functions and feature logic in space-constrained consumer products using the compact BGA package.

Unique Advantages

• Compact mid-range logic capacity: 3,888 logic elements provide enough resources to consolidate multiple discrete functions into a single FPGA, reducing BOM complexity.
• On-chip RAM for buffering: Approximately 49,152 bits of embedded memory support temporary data storage, small FIFOs and state machines without external RAM.
• High I/O count: 260 available I/Os enable flexible interfacing to peripherals, sensors and external controllers, simplifying board-level connectivity.
• BGA surface-mount package: 456-ball BGA (456-FBGA 23×23) offers a compact footprint and reliable soldered mounting for denser PCB designs.
• Commercial operating range: Specified operation from 0 °C to 85 °C aligns with a wide range of consumer and commercial deployments.
• RoHS compliant: Meets environmental requirements for lead-free manufacturing and regulatory compliance needs.

Why Choose XC2S150-6FGG456C?

The XC2S150-6FGG456C is positioned as a commercially graded, mid-range Spartan®-II FPGA that combines a practical complement of logic elements, embedded RAM and a high I/O count in a compact BGA package. Its specifications make it suitable for designers seeking to consolidate discrete logic, add custom peripheral interfaces or prototype system-level digital functions within commercial temperature limits.

This device offers predictable, verifiable resources—3,888 logic elements, approximately 49,152 bits of on-chip memory, 260 I/Os and a 2.375–2.625 V core supply—that support scalable integration and simplified board designs for commercial embedded products.

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