XC2S150-6PQG208C

The XC2S150-6PQG208C is a Spartan®-II field programmable gate array (FPGA) from AMD designed for commercial applications requiring flexible, programmable logic capacity. It integrates 3,888 logic elements, approximately 49,152 bits of embedded RAM, and 140 user I/O in a 208-pin surface-mount package.

This device is supplied with a core voltage range of 2.375 V to 2.625 V and is specified for commercial operating temperatures from 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Core Logic — 3,888 logic elements and approximately 150,000 gates provide programmable fabric for implementing custom combinational and sequential logic.
• Embedded Memory — 49,152 bits of on-chip RAM (approximately 0.049 Mbits) for data buffering, state storage, and small lookup tables.
• I/O Density — 140 user I/O pins support multiple parallel interfaces and external device connectivity within the package constraints.
• Package & Mounting — Delivered in a 208‑pin BFQFP package; supplier device package listed as 208‑PQFP (28×28). Surface-mount mounting type facilitates PCB assembly.
• Power — Defined core supply range of 2.375 V to 2.625 V to match system power architecture requirements.
• Environmental & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

• Control Logic and Glue — Implement custom interface bridging and glue logic where moderate logic density and numerous I/Os are required.
• Parallel I/O Management — Manage and route multiple parallel data lines using the device's 140 available I/O pins.
• Small Embedded Memory Tasks — Use on-chip RAM for buffering, small FIFOs, and state machines in compact designs.

Unique Advantages

• Compact, Programmable Capacity: 3,888 logic elements and roughly 150,000 gates provide a balance of logic resources for medium-complexity designs.
• On-chip RAM for Local Storage: 49,152 bits of embedded memory reduce dependence on external RAM for small buffers and state storage.
• Generous I/O Count: 140 user I/Os enable rich peripheral and parallel interface support without additional I/O expanders.
• Standard Surface-mount Package: 208‑pin BFQFP/PQFP packaging supports common PCB assembly flows and density requirements.
• Commercial Operating Range: Specified 0 °C to 85 °C operation aligns with a wide set of commercial applications and deployments.
• RoHS Compliant: Conforms to RoHS requirements for lead-free assembly and regulatory alignment.

Why Choose XC2S150-6PQG208C?

The XC2S150-6PQG208C positions itself as a versatile commercial-grade FPGA option that combines moderate logic capacity, embedded RAM, and a high I/O count in a compact 208-pin package. Its defined core voltage range and commercial temperature rating make it suitable for a broad range of programmable-logic tasks where board-level integration and component standardization matter.

This device is well suited for engineering teams and procurement seeking a programmable solution for medium-complexity designs that require localized memory, multiple I/Os, and a standard surface-mount package, while maintaining RoHS compliance.

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