XC2S200-5FG256I

The XC2S200-5FG256I is a Spartan®-II field programmable gate array (FPGA) from AMD, delivered in a 256-FBGA (17×17) surface-mount package. It provides a balance of programmable logic, on-chip memory, and I/O density for industrial-grade embedded designs.

With 5,292 logic elements, approximately 57.3 Kbits of embedded memory, and up to 176 I/O pins, this device targets applications that need moderate logic capacity, significant on-chip RAM, and robust operating conditions. It operates from a 2.375 V to 2.625 V supply and is specified for -40 °C to 100 °C environments.

Key Features

• Core Logic  5,292 logic elements providing programmable resources to implement custom digital functions and moderate-complexity logic designs.
• Embedded Memory  Approximately 57.3 Kbits of on-chip RAM for buffering, state storage, and small lookup tables.
• I/O Capacity  176 I/O pins to support a wide range of peripheral interfaces and system interconnects.
• Logic Scale  Approximately 200,000 gates for aggregate device complexity and integration of multiple digital functions.
• Package and Mounting  256-FBGA (17×17) package in a 256-BGA case, designed for surface-mount assembly to minimize board area.
• Power  Voltage supply range of 2.375 V to 2.625 V for core operation.
• Industrial Temperature Range  Rated to operate from -40 °C to 100 °C for use in industrial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use the device for control logic and interface glue in machines and automation systems that require industrial temperature operation and substantial I/O connectivity.
• Embedded Logic and Prototyping  Deploy the FPGA for custom digital functions and proof-of-concept designs using its 5,292 logic elements and on-chip RAM.
• Communication and Interface Bridging  Implement protocol conversions and parallel/serial bridging leveraging the 176 available I/O pins and programmable logic resources.

Unique Advantages

• Balanced Logic and Memory: 5,292 logic elements combined with approximately 57.3 Kbits of embedded RAM allow integration of control, buffering, and small-data-path functions on a single device.
• High I/O Density: 176 I/O pins enable rich interfacing options without external I/O expander components, reducing BOM complexity.
• Industrial Reliability: Specified operation from -40 °C to 100 °C supports deployment in industrial environments where wide temperature tolerance is required.
• Compact, Surface-Mount Package: The 256-FBGA (17×17) package minimizes board footprint while supporting reliable surface-mount assembly.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious designs and supply-chain compatibility.
• Deterministic Power Range: Defined core voltage range (2.375 V to 2.625 V) simplifies power-supply design and integration.

Why Choose XC2S200-5FG256I?

The XC2S200-5FG256I positions itself as a practical FPGA option for designers needing a combination of moderate programmable logic, embedded memory, and substantial I/O in an industrial-grade device. Its mix of 5,292 logic elements, approximately 57.3 Kbits of on-chip RAM, and 176 I/O pins supports the consolidation of multiple functions into a single programmable device, reducing component count and board complexity.

This part is appropriate for teams and projects that require a compact, surface-mount FPGA with defined voltage and temperature specifications, offering predictable integration into industrial and embedded systems. Its RoHS compliance and standard FBGA packaging help streamline manufacturing and regulatory considerations.

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