XC2S200-5FG456I

The XC2S200-5FG456I is a Spartan®-II field programmable gate array (FPGA) from AMD, packaged in a 456-ball BGA for surface-mount applications. It provides a balanced combination of reprogrammable logic capacity, on-chip memory, and a high I/O count for embedded and industrial designs.

Key characteristics include approximately 5,292 logic elements, about 57,344 bits of embedded memory, 284 user I/O pins, and an operating temperature range of −40 °C to 100 °C, with a supply voltage range of 2.375 V to 2.625 V.

Key Features

• Logic Capacity Approximately 5,292 logic elements and an estimated 200,000 gates to implement custom digital functions and state machines.
• Embedded Memory Approximately 57,344 bits of on-chip RAM for buffering, FIFOs, and small data storage requirements.
• I/O and Interfacing 284 user I/O pins to support a wide range of parallel and serial interfacing needs.
• Power and Voltage Designed for a core supply voltage range of 2.375 V to 2.625 V to match platform power requirements.
• Package and Mounting 456-ball BGA package (supplier device package: 456-FBGA, 23×23) optimized for surface-mount assembly in compact systems.
• Temperature and Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliant Meets RoHS requirements for lead-free manufacturing processes.

Typical Applications

• Industrial Control Use as programmable control logic in industrial systems where the −40 °C to 100 °C range and industrial grade reliability are required.
• Embedded Systems Implement custom data paths, glue logic, and interface adaptation using the device’s logic elements, on-chip RAM, and high I/O count.
• Communications and I/O Aggregation Aggregate and route signals between subsystems leveraging 284 I/O pins for parallel and multi-channel interfaces.
• Prototyping and Custom Logic Develop and iterate digital designs that benefit from reprogrammability and moderate logic/memory resources.

Unique Advantages

• Balanced Logic and Memory: Approximately 5,292 logic elements combined with roughly 57,344 bits of embedded RAM supports a wide range of control and data buffering tasks.
• High I/O Density: 284 user I/O pins enable flexible connectivity for sensor interfaces, bus bridges, and multi-channel signal routing.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in industrial environments and temperature-variable deployments.
• Compact BGA Packaging: 456-ball BGA (456-FBGA, 23×23) provides a high-pin-count solution in a compact footprint suitable for space-constrained boards.
• RoHS Compliance: Aligns with lead-free manufacturing and environmental compliance requirements.
• Defined Supply Window: Core voltage specification of 2.375 V to 2.625 V enables predictable power planning and integration with system rails.

Why Choose XC2S200-5FG456I?

The XC2S200-5FG456I positions itself as a practical FPGA choice for embedded and industrial designs that require moderate logic resources, on-chip memory, and substantial I/O capability in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for applications where environmental resilience and regulatory alignment matter.

This device is appropriate for engineering teams implementing custom control, interfacing, or data-handling logic who need reprogrammable capacity backed by the Spartan®-II family documentation and ecosystem resources.

Request a quote or submit a sales inquiry for the XC2S200-5FG456I to discuss availability, pricing, and delivery options tailored to your project requirements.