XC2S200-5FG256C

The XC2S200-5FG256C is a Spartan®-II field programmable gate array (FPGA) supplied by AMD. It combines a mid-range logic resource set with on-chip RAM and a high-pin-count BGA package to support reconfigurable digital designs.

This commercial-grade FPGA is intended for designs that require up to 5,292 logic elements, approximately 57 kbits of embedded memory, and 176 general-purpose I/O signals while operating within standard commercial temperature and voltage ranges.

Key Features

• Core Logic  5,292 logic elements provide the programmable fabric for implementing custom digital functions and glue logic.
• Embedded Memory  Approximately 57 kbits of on-chip RAM (57,344 total RAM bits) available for data buffering, FIFOs, and small lookup tables.
• I/O Capacity  176 user I/O pins to support multiple external interfaces and parallel connections on board-level designs.
• Gate Count  Equivalent to 200,000 gates for estimating overall design density and resource planning.
• Power and Voltage  Operates from a core supply range of 2.375 V to 2.625 V to match common FPGA power domains.
• Package & Mounting  256-BGA package (supplier device package: 256-FBGA, 17×17) optimized for surface-mount assembly and compact board layouts.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C, suitable for standard consumer and commercial electronics.
• Environmental Compliance  RoHS compliant for material and process conformity in regulated markets.

Typical Applications

• Reconfigurable Digital Logic  Implement custom finite state machines, protocol bridges, and glue logic where programmable hardware is required.
• Board-Level Prototyping  Use on development and evaluation boards to validate digital designs before production.
• Custom I/O Interfacing  Bridge peripherals and sensors with flexible I/O pin count to adapt to varied on-board connectivity needs.

Unique Advantages

• Balanced Logic and Memory  Combines 5,292 logic elements with ~57 kbits of embedded RAM to support both control logic and modest data buffering.
• High I/O Density  176 I/O pins allow integration of multiple external interfaces without additional bus extenders.
• Compact BGA Footprint  The 256-FBGA (17×17) package supports high-density board layouts while enabling surface-mount assembly processes.
• Defined Commercial Operating Range  Rated 0 °C to 85 °C for designs targeting consumer and commercial environments.
• Manufacturer Backing  Supplied by AMD, providing a known source for product lifecycle and component consistency.
• RoHS Compliant  Meets common environmental material requirements for global electronics manufacturing.

Why Choose XC2S200-5FG256C?

The XC2S200-5FG256C is positioned for designers who need a commercially graded Spartan®-II FPGA with a balanced mix of logic, memory, and I/O in a compact 256-BGA package. Its combination of 5,292 logic elements, approximately 57 kbits of on-chip RAM, and 176 I/Os makes it suitable for a broad range of reconfigurable digital tasks on consumer and commercial products.

Choosing this AMD-supplied device provides a clear specification set for planning BOMs and board layouts, with RoHS compliance and a standard supply voltage and temperature rating that align with common assembly and operating requirements.

Request a quote or submit a pricing inquiry for the XC2S200-5FG256C to check availability and lead times for your next design.