XC2S150-5FGG456I

The XC2S150-5FGG456I is an AMD Spartan®-II field programmable gate array (FPGA) supplied in a 456-ball BGA package. It provides a balanced combination of logic density, on-chip memory and I/O capability for custom digital designs used in industrial applications.

With 3,888 logic elements, approximately 49,152 bits of embedded memory, 260 user I/O pins and an industrial operating range, this device is targeted at designs that require mid-range programmable logic capacity in a compact surface-mount form factor.

Key Features

• Core Logic  3,888 logic elements (864 CLBs) and an estimated 150,000 gates provide mid-range programmable logic capacity for implementing custom digital functions.
• Embedded Memory  49,152 bits of on-chip RAM (approximately 0.05 Mbits) to support local storage, buffering and state machine implementations.
• I/O Capacity  260 user I/O pins allow broad connectivity to external peripherals, interfaces and system components.
• Power Supply  Supported core supply voltage range of 2.375 V to 2.625 V for device operation.
• Package and Mounting  456-ball BGA surface-mount package (supplier package: 456-FBGA, 23×23) for high pin-count in a compact PCB footprint.
• Operating Range  Industrial-grade temperature range from −40 °C to 100 °C suitable for many industrial and deployed environments.
• Compliance  RoHS-compliant manufacturing status.

Typical Applications

• Industrial Control  Implement custom control logic, sensor interfacing and deterministic state machines using the FPGA’s logic elements and I/O capacity.
• Communications Equipment  Use the device for protocol handling, data buffering and custom bus interfacing where moderate logic density and on-chip RAM are required.
• Embedded Systems  Integrate glue logic, timing control and peripheral aggregation in compact systems that benefit from a high pin-count BGA package.
• Prototyping and Development  Evaluate and iterate custom digital functions and system integration using the programmable resources and accessible I/O.

Unique Advantages

• Balanced Logic and Memory:  3,888 logic elements paired with 49,152 bits of embedded RAM support a wide range of mid-range digital designs without external memory for many functions.
• High I/O Count in Compact Package:  260 I/O pins in a 456-ball BGA (456-FBGA, 23×23) provide extensive connectivity while minimizing PCB area.
• Industrial Temperature Rating:  Rated for −40 °C to 100 °C operation to meet demands of industrial and harsh-environment deployments.
• Controlled Core Voltage:  Narrow supply voltage range (2.375 V–2.625 V) simplifies power rail planning for the FPGA core.
• RoHS Compliance:  Manufactured to RoHS standards for environmental and regulatory alignment.

Why Choose XC2S150-5FGG456I?

The XC2S150-5FGG456I offers a practical mix of logic density, embedded memory and extensive I/O in an industrial-grade, surface-mount BGA package. It is appropriate for engineers and teams building mid-range programmable logic solutions that require reliable operation across a wide temperature range and a compact, high-pin-count footprint.

This FPGA is suitable for projects that need scalable, on-board programmable logic—such as industrial control modules, communications interfaces and embedded system integration—delivering long-term value through a combination of integration, robustness and accessible device resources.

Request a quote or submit an inquiry to obtain pricing and availability for the XC2S150-5FGG456I. Our team will respond with lead time, volume pricing and ordering information to support your design and procurement needs.