XC2S150-5FGG456C

The XC2S150-5FGG456C is a Spartan®-II Field Programmable Gate Array (FPGA) IC from AMD, offering a mid-range programmable logic fabric with 3,888 logic elements and 864 CLBs. Designed for commercial electronic applications, it provides a balance of logic capacity, I/O count and on-chip RAM for implementing custom digital functions and glue logic in embedded systems.

With 260 I/Os, approximately 49,152 bits of embedded memory and a 456-ball BGA package, this device targets space-constrained PCBs that require a configurable hardware resource with a defined commercial operating range.

Key Features

• Core Logic  Approximately 3,888 logic elements implemented across 864 CLBs, supporting a wide range of user-defined digital designs.
• On-Chip Memory  Total embedded memory of 49,152 bits (approximately 0.049 Mbits) to support data buffering, small FIFOs and state storage without external RAM.
• I/O Capacity  260 general-purpose I/O pins suitable for interfacing with peripherals, sensors and other digital components.
• Gate Count  Approximately 150,000 gates to represent overall device complexity and implementation scope for system logic.
• Power  Operates from a core supply range of 2.375 V to 2.625 V, enabling predictable power budgeting for the programmable core.
• Package & Mounting  456-ball BGA package (listed as 456-BBGA and 456-FBGA 23×23) with surface-mount mounting for compact board designs.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for standard commercial environments.
• RoHS Compliant  Manufactured to meet RoHS requirements for reduced hazardous substances.

Typical Applications

• Embedded Systems  Implement custom control logic, protocol handling and glue logic where a moderate amount of programmable logic and on-chip RAM is required.
• Consumer Electronics  Provide configurable interfaces and logic in consumer devices that operate within commercial temperature ranges.
• Industrial and Instrumentation  Support data aggregation, simple signal processing and I/O expansion in commercial-grade instrumentation and automation equipment.

Unique Advantages

• Balanced Logic Capacity:  3,888 logic elements and 864 CLBs deliver a mid-range resource set for implementing complex glue logic without over-specifying the design.
• Generous I/O Count:  260 I/Os reduce the need for external multiplexing or expanders when interfacing with multiple peripherals or buses.
• On-Chip Memory Availability:  49,152 bits of embedded RAM allow local buffering and state retention, simplifying board-level memory requirements.
• Compact Packaging:  456-ball BGA in a 23×23 footprint enables higher-density PCB layouts for space-constrained applications.
• Commercial-Grade Operation:  0 °C to 85 °C rating and RoHS compliance make the device suitable for a wide range of standard electronic products.

Why Choose XC2S150-5FGG456C?

The XC2S150-5FGG456C positions itself as a practical, mid-range FPGA choice for commercial designs that require a balance of logic resources, I/O flexibility and on-chip memory in a compact BGA package. Its defined supply range and temperature rating simplify power and thermal planning for standard embedded applications.

Backed by AMD’s Spartan®-II family heritage, this device is appropriate for design teams seeking a commercially rated, programmable logic device to implement custom digital functions, interface logic and moderate data buffering within constrained board real estate.

Request a quote or contact sales to discuss availability, pricing and how the XC2S150-5FGG456C can fit into your next design.