XC2S150-5FGG256C

The XC2S150-5FGG256C is a Spartan®-II field programmable gate array (FPGA) supplied in a 256-ball BGA package. It integrates a mix of configurable logic blocks, embedded memory, and a substantial I/O count for implementing custom digital functions in compact assemblies.

Designed for commercial-temperature applications, this device is suited to designers building digital processing, control and interface solutions that require mid-range logic capacity, on-chip memory and a high number of I/O pins.

Key Features

• Logic Capacity  864 CLBs and 3,888 logic elements provide the programmable fabric for implementing custom digital logic and state machines.
• Embedded Memory  Approximately 49 kbits of on-chip RAM (49,152 total RAM bits) for buffering, FIFOs and small data storage.
• I/O Resources  176 I/O pins to support multiple external interfaces, parallel buses and signal routing.
• Gate Equivalent  Equivalent to 150,000 gates for estimating integration density in mixed-logic designs.
• Power and Supply  Operates from a core voltage supply range of 2.375 V to 2.625 V, allowing designers to plan power domains precisely.
• Package and Mounting  256-ball BGA package (256-FBGA, 17×17) with surface-mount mounting type for compact board-level integration.
• Temperature and Grade  Commercial grade device specified for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom Digital Logic  Implement glue logic, protocol bridges and custom finite-state machines using the device's configurable logic and CLBs.
• Interface and I/O Expansion  Use the 176 I/O pins to add parallel interfaces, level-shifting buffers, or to bridge multiple peripheral buses.
• Embedded Memory Functions  Employ the on-chip RAM for small data buffers, FIFOs or lookup tables within control and processing pipelines.

Unique Advantages

• Moderate Logic Density:  3,888 logic elements and 864 CLBs offer ample resources for mid-range integration without the cost and complexity of larger devices.
• On-Chip Memory:  Approximately 49 kbits of embedded RAM reduces the need for external memory in many buffering and control tasks.
• High I/O Count:  176 I/Os enable flexible external interfacing and simplify board-level connectivity.
• Compact BGA Package:  256-FBGA (17×17) delivers a small PCB footprint suitable for space-constrained designs.
• Predictable Power Envelope:  Defined core voltage range (2.375 V to 2.625 V) supports clear power-supply planning in multi-voltage systems.
• RoHS Compliant:  Conforms to environmental directives for lead-free assembly processes.

Why Choose XC2S150-5FGG256C?

The XC2S150-5FGG256C positions itself as a compact, mid-capacity Spartan®-II FPGA option that balances programmable logic, embedded RAM and extensive I/O in a 256-BGA footprint. Its combination of 3,888 logic elements, approximately 49 kbits of memory and 176 I/O pins makes it suitable for designers who need to consolidate digital functions while maintaining a small board footprint.

With a defined supply voltage range and commercial operating temperature specification, this device provides predictable integration for a broad range of commercial electronic products where mid-range FPGA capability, on-chip buffering and flexible interfacing are required.

Please request a quote or submit pricing and availability information to initiate procurement for the XC2S150-5FGG256C.