XC2S150-5FG256C

The XC2S150-5FG256C is a Spartan®-II Field Programmable Gate Array (FPGA) IC designed for commercial embedded applications that require moderate logic density and substantial I/O. It provides a balance of on-chip resources and compact packaging for integration into space-constrained, surface-mount designs.

This device combines 3,888 logic elements, approximately 0.05 Mbits of embedded memory, and 176 general-purpose I/Os in a 256-ball BGA package, making it suited to glue-logic, interface bridging, and control tasks in commercial electronics.

Key Features

• Logic Capacity  3,888 logic elements (equivalent to approximately 150,000 gates) for implementing mid-range combinational and sequential logic.
• Configurable Logic Blocks  864 CLB structures to organize user logic functions and support common FPGA design flows.
• Embedded Memory  49,152 bits of on-chip RAM—approximately 0.05 Mbits—available for data buffering, small FIFOs, and state storage.
• I/O and Package  176 I/O pins in a compact 256-BGA package; supplier device package listed as 256-FBGA (17×17) for high pin density in surface-mount applications.
• Power  Supported core voltage range from 2.375 V to 2.625 V, enabling straightforward power-supply integration for the FPGA core.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation, suitable for a wide range of non-industrial environments.
• Mounting & Compliance  Surface-mount package and RoHS compliance for modern assembly and environmental requirements.

Typical Applications

• Consumer and Commercial Embedded Control  Implement control logic, state machines, and peripheral management in consumer devices and commercial equipment within the specified temperature range.
• Interface Bridging and Glue Logic  Consolidate multiple discrete interface components into a single programmable device using available I/O and logic resources.
• Prototyping and Development Platforms  Use the device for functional prototyping where moderate logic density and a compact BGA footprint are required.
• Instrumentation and Measurement (Commercial)  Integrate custom timing, I/O handling, and data buffering functions for commercial-grade test and measurement equipment.

Unique Advantages

• Moderate Logic Density: 3,888 logic elements and ~150,000-gate equivalence provide sufficient capacity for mid-range designs without unnecessary complexity.
• Generous I/O Count: 176 I/Os enable direct interfacing to multiple peripherals, sensors, and system buses, reducing external glue components.
• Compact, High-Density Package: 256-BGA (256-FBGA, 17×17) offers a small PCB footprint while maintaining high pin count for dense designs.
• On-Chip Memory: Approximately 0.05 Mbits of embedded RAM supports buffering and localized storage for control and data-handling tasks.
• RoHS Compliant & Surface Mount: Facilitates modern manufacturing processes and environmental compliance for commercial product assemblies.

Why Choose XC2S150-5FG256C?

The XC2S150-5FG256C positions itself as a versatile, commercial-grade FPGA for designs that require a practical balance of logic capacity, embedded memory, and a high I/O count in a compact BGA package. Its specification set supports consolidation of interface and control functions while fitting standard surface-mount assembly flows.

This device is well suited to engineers and product teams developing consumer and commercial electronic systems that need a programmable, mid-density logic solution with RoHS compliance and a clearly defined operating voltage and temperature range.

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