XC2S150-5FG256I

The XC2S150-5FG256I is an AMD Spartan®-II field programmable gate array delivered in a 256-BGA package. It integrates a moderate logic capacity with on-chip RAM and a high I/O count for compact, board-level digital designs.

Designed for industrial-grade operation, this surface-mount FPGA combines 3,888 logic elements, approximately 49,152 bits of embedded RAM, and 176 I/Os, making it suitable for embedded and industrial applications that require reliable operation across a wide temperature range.

Key Features

• Core Logic  3,888 logic elements and approximately 150,000 gates for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 49,152 bits of on-chip RAM for local buffering and state storage.
• I/O Density  176 programmable I/Os to support multiple peripheral connections and signal interfacing directly on-chip.
• Package & Mounting  256-BGA / 256-FBGA (17×17) package in a surface-mount form factor for compact integration on PCBs.
• Power  Core supply voltage range of 2.375 V to 2.625 V to match target power-rail designs.
• Operating Temperature  Industrial-grade operation from −40 °C to 100 °C for deployments in demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Leverages industrial temperature rating and robust I/O to implement control logic and interface with field devices in automation systems.
• Embedded Systems  Implements custom glue logic, protocol handling, and state machines where moderate logic capacity and on-chip RAM are required.
• I/O Expansion & Interface Bridging  176 I/Os enable aggregation of peripherals, bus bridging, and parallel interface implementations without extensive external circuitry.
• Prototyping and Low-Volume Products  Compact 256-BGA packaging and surface-mount mounting simplify board-level prototypes and small production runs.

Unique Advantages

• Balanced Logic and Memory: 3,888 logic elements paired with approximately 49,152 bits of embedded RAM provide capacity for both combinational logic and stateful designs.
• High I/O Count: 176 I/Os reduce the need for external expanders and simplify board-level connectivity.
• Industrial Temperature Capability: Rated for −40 °C to 100 °C operation to meet many industrial deployment requirements.
• Compact, High-Pin Package: 256-FBGA (17×17) delivers high pin density in a compact surface-mount footprint for space-constrained designs.
• Regulatory Compliance: RoHS compliant for environmentally conscious manufacturing and procurement.
• Controlled Power Range: Narrow supply voltage window (2.375–2.625 V) that helps simplify power-rail design and verification.

Why Choose XC2S150-5FG256I?

The XC2S150-5FG256I positions itself as a reliable, industrial-grade FPGA option for designers needing a balanced combination of logic, embedded memory, and a high I/O count in a compact BGA package. Its specified operating range and RoHS compliance make it suitable for industrial and embedded applications where environmental robustness and regulatory compliance matter.

Backed by AMD manufacturing, this device is appropriate for development and deployment scenarios that require moderate gate density, local RAM resources, and extensive I/O connectivity while maintaining a compact board footprint.

Request a quote or submit a pricing inquiry for the XC2S150-5FG256I to receive availability and procurement details.