XC2S150-5FG456I

The XC2S150-5FG456I is a Spartan®-II family field programmable gate array (FPGA) offered in a 456-ball BGA package. It provides a balance of on-chip logic, embedded memory, and high I/O count for industrial embedded designs.

With 3,888 logic elements, 260 I/O pins and operation across an industrial temperature range, this device targets system integration tasks that require configurable logic, moderate embedded memory, and robust operating conditions.

Key Features

• Core Logic  Provides 3,888 logic elements and approximately 150,000 gates for implementing custom digital functions.
• Embedded Memory  Includes 49,152 bits of on-chip RAM — approximately 0.049 Mbits of embedded memory for buffering and small-data storage.
• High I/O Density  260 I/O pins support extensive peripheral interfacing and board-level connectivity.
• Package and Mounting  Supplied in a 456-BBGA package (supplier device package: 456-FBGA, 23×23) with surface-mount mounting for compact system integration.
• Power  Typical core supply range documented at 2.375 V to 2.625 V to match target system power rails.
• Industrial Temperature Range  Qualified to operate from −40 °C to 100 °C for deployment in industrial environments.
• Environmental Compliance  RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• Industrial Control  Programmable logic and I/O aggregation for factory automation, PLC add-ons, and control interfaces benefiting from the device’s industrial temperature range and high I/O count.
• Embedded System Integration  Custom glue logic, protocol bridging, and peripheral management where configurable logic and multiple I/O are required.
• Prototyping and Development  Hardware prototyping and evaluation of mid-density FPGA-based designs using a compact BGA footprint.

Unique Advantages

• Balanced Logic Capacity:  3,888 logic elements and ~150,000 gates provide ample resources for mid-complexity digital designs without excessive cost or board area.
• Generous I/O Count:  260 I/O pins enable broad peripheral connectivity and flexible board-level interfacing options.
• Industrial Suitability:  Rated for −40 °C to 100 °C operation, supporting deployment in demanding environmental conditions.
• Compact BGA Package:  456-ball BGA (456-FBGA, 23×23) allows high-density routing and small PCB footprint for space-constrained applications.
• Low-Level On-Chip Memory:  Approximately 0.049 Mbits of embedded RAM for buffering, small FIFOs, and state storage within designs.
• RoHS Compliant:  Supports lead-free assembly and compliance with common environmental manufacturing requirements.

Why Choose XC2S150-5FG456I?

The XC2S150-5FG456I positions itself as a mid-density Spartan®-II FPGA option that balances logic resources, I/O capability, and industrial-grade operating range. Its combination of 3,888 logic elements, substantial I/O, and a compact 456-ball BGA package makes it well suited for industrial embedded applications, prototyping, and system integration tasks where configurable logic and robust environmental performance are required.

Choosing this device offers designers scalability within FPGA-based designs, a compact package for dense board layouts, and RoHS compliance for modern manufacturing flows.

Request a quote or submit a request for pricing and availability to get started with the XC2S150-5FG456I in your next design.