XC2S150-5FGG256I
| Part Description |
Spartan®-II Field Programmable Gate Array (FPGA) IC 176 49152 3888 256-BGA |
|---|---|
| Quantity | 1,918 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 176 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 864 | Number of Logic Elements/Cells | 3888 | ||
| Number of Gates | 150000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of XC2S150-5FGG256I – Spartan®-II Field Programmable Gate Array (FPGA)
The XC2S150-5FGG256I is a Spartan®-II field programmable gate array IC offered in a 256-ball BGA package. It provides a mid-range logic density with on-chip RAM and a broad I/O complement for a variety of embedded digital designs. This device is offered in an industrial temperature grade and is RoHS compliant.
Key Features
- Logic Capacity 3888 logic elements enabling moderate complexity digital designs and custom logic implementations.
- Embedded Memory Approximately 0.049 Mbits of embedded memory (49,152 bits) for local storage, buffering, and small lookup tables.
- I/O Density 176 user I/O pins to support multiple external interfaces and parallel connections.
- Device Density Approximately 150,000 gates for integration of combinational and sequential logic functions.
- Power Core supply specified at 2.375 V to 2.625 V for device operation within the defined voltage window.
- Package 256-BGA (supplier device package: 256-FBGA, 17×17) in a surface-mount format suitable for compact boards.
- Temperature Range Industrial operating temperature range from −40°C to 100°C for deployment in elevated-temperature environments.
- ROHS Compliance Device is RoHS compliant, supporting regulatory requirements for lead-free assemblies.
Unique Advantages
- Balanced logic and memory Combines 3888 logic elements with 49,152 bits of on-chip RAM to implement a range of control, connectivity, and data-path functions on a single device.
- High I/O count 176 I/O pins allow flexible interfacing to peripherals, sensors, and external memory without resorting to additional interface chips.
- Industrial temperature capability Rated for operation from −40°C to 100°C to address designs that require extended thermal range.
- Compact surface-mount BGA 256-ball FBGA (17×17) package supports high-density PCB layouts while maintaining robust soldered connections.
- Controlled core voltage Narrow supply range (2.375 V to 2.625 V) supports predictable power design and margining for the FPGA core.
- Regulatory readiness RoHS compliance eases integration into lead-free assemblies and supply-chain requirements.
Why Choose XC2S150-5FGG256I?
The XC2S150-5FGG256I positions itself as a practical FPGA option for designs that require a mid-level logic count, a modest amount of embedded RAM, and a large number of I/O in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-life, regulated production programs where predictable environmental performance and regulatory conformity matter.
Choose this device when your design needs a combination of moderate gate density, flexible interfacing, and a compact surface-mount package that fits standard board layouts and assembly flows.
Request a quote or submit a purchase inquiry for XC2S150-5FGG256I to obtain pricing and availability information for your next project.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








