XC2S150-5FGG256I

IC FPGA 176 I/O 256FBGA
Part Description

Spartan®-II Field Programmable Gate Array (FPGA) IC 176 49152 3888 256-BGA

Quantity 1,918 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O176Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs864Number of Logic Elements/Cells3888
Number of Gates150000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of XC2S150-5FGG256I – Spartan®-II Field Programmable Gate Array (FPGA)

The XC2S150-5FGG256I is a Spartan®-II field programmable gate array IC offered in a 256-ball BGA package. It provides a mid-range logic density with on-chip RAM and a broad I/O complement for a variety of embedded digital designs. This device is offered in an industrial temperature grade and is RoHS compliant.

Key Features

  • Logic Capacity  3888 logic elements enabling moderate complexity digital designs and custom logic implementations.
  • Embedded Memory  Approximately 0.049 Mbits of embedded memory (49,152 bits) for local storage, buffering, and small lookup tables.
  • I/O Density  176 user I/O pins to support multiple external interfaces and parallel connections.
  • Device Density  Approximately 150,000 gates for integration of combinational and sequential logic functions.
  • Power  Core supply specified at 2.375 V to 2.625 V for device operation within the defined voltage window.
  • Package  256-BGA (supplier device package: 256-FBGA, 17×17) in a surface-mount format suitable for compact boards.
  • Temperature Range  Industrial operating temperature range from −40°C to 100°C for deployment in elevated-temperature environments.
  • ROHS Compliance  Device is RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Unique Advantages

  • Balanced logic and memory  Combines 3888 logic elements with 49,152 bits of on-chip RAM to implement a range of control, connectivity, and data-path functions on a single device.
  • High I/O count  176 I/O pins allow flexible interfacing to peripherals, sensors, and external memory without resorting to additional interface chips.
  • Industrial temperature capability  Rated for operation from −40°C to 100°C to address designs that require extended thermal range.
  • Compact surface-mount BGA  256-ball FBGA (17×17) package supports high-density PCB layouts while maintaining robust soldered connections.
  • Controlled core voltage  Narrow supply range (2.375 V to 2.625 V) supports predictable power design and margining for the FPGA core.
  • Regulatory readiness  RoHS compliance eases integration into lead-free assemblies and supply-chain requirements.

Why Choose XC2S150-5FGG256I?

The XC2S150-5FGG256I positions itself as a practical FPGA option for designs that require a mid-level logic count, a modest amount of embedded RAM, and a large number of I/O in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-life, regulated production programs where predictable environmental performance and regulatory conformity matter.

Choose this device when your design needs a combination of moderate gate density, flexible interfacing, and a compact surface-mount package that fits standard board layouts and assembly flows.

Request a quote or submit a purchase inquiry for XC2S150-5FGG256I to obtain pricing and availability information for your next project.

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