XC2S150-5FG456C

The XC2S150-5FG456C is a Spartan®-II Field Programmable Gate Array by AMD, provided in a 456-ball BGA surface-mount package. It delivers a mid-range mix of logic, I/O and on-chip memory resources for commercial-temperature embedded and digital designs.

With 3,888 logic elements, 260 user I/O pins and 49,152 bits of on-chip RAM, this device targets designs that require moderate programmable logic capacity and flexible interfacing in a compact BGA footprint.

Key Features

• Core Logic  Approximately 3,888 logic elements and an equivalent gate count of 150,000 provide a programmable fabric for custom digital functions.
• On-chip Memory  Total RAM of 49,152 bits (approximately 0.05 Mbits) for data buffering, small FIFOs and state storage.
• I/O Resources  260 user I/O pins support a wide range of external interfaces and parallel connectivity on a single device.
• Power  Operates from a core supply voltage range of 2.375 V to 2.625 V, enabling consistent power planning for system design.
• Package & Mounting  456-BBGA (supplier package: 456-FBGA, 23×23) in a surface-mount configuration for compact board-level integration.
• Operating Conditions  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS-compliant to support lead-free manufacturing processes.

Typical Applications

• Prototyping and Evaluation  Use the device's logic and I/O resources to implement and iterate custom digital designs and interface proof-of-concept systems.
• Embedded Control  Implement control logic, glue-logic or state machines that benefit from reprogrammability and on-chip memory for small data structures.
• Peripheral and Interface Bridging  Leverage the 260 I/O pins to consolidate multiple parallel interfaces or to act as a protocol bridge between system components.

Unique Advantages

• Balanced logic capacity: 3,888 logic elements and 150,000 gates provide sufficient programmable resources for mid-scale digital designs without overprovisioning.
• Generous I/O count: 260 I/Os enable high pin-count connectivity, reducing the need for external interface chips in many designs.
• On-chip memory for buffering: 49,152 bits of embedded RAM (≈0.05 Mbits) supports small FIFOs, registers and temporary data storage directly in the FPGA fabric.
• Compact BGA footprint: 456-ball BGA (456-FBGA, 23×23) supports high-density PCB layouts while keeping board real estate economical.
• Commercial temperature range: Rated for 0 °C to 85 °C operation to suit standard commercial embedded applications.
• RoHS compliant: Facilitates compliance with lead-free manufacturing and environmental requirements.

Why Choose XC2S150-5FG456C?

The XC2S150-5FG456C offers a balanced combination of logic, I/O and embedded memory in a compact BGA package, making it well suited for commercial embedded and digital designs that require reprogrammable logic with substantial interfacing capability. Its defined voltage range and commercial temperature rating allow straightforward system integration for production designs.

This device is appropriate for engineering teams seeking a reliable Spartan®-II FPGA platform with moderate resource density, compact board-level packaging and RoHS compliance—delivering practical programmability and flexibility for a range of mid-scale applications.

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