XC2S200-6FG256C

The XC2S200-6FG256C is a Spartan®-II family field programmable gate array supplied in a 256-ball BGA package. It combines a mid-range logic capacity with a substantial I/O count and embedded memory, making it suitable for commercial applications that require flexible, reprogrammable digital logic.

Designed for surface-mount assembly and RoHS compliance, this device targets designers needing a compact, reconfigurable silicon option with clearly defined power and thermal operating ranges.

Key Features

• Logic Capacity  5,292 logic elements providing approximately 200,000 gates for implementing custom digital functions and glue logic.
• Embedded Memory  Approximately 0.057 Mbits of on-chip RAM (57,344 bits) to support data buffering, FIFOs, and small on-chip storage needs.
• I/O Density  176 user I/O pins to support interfaces, parallel buses, and multiple external peripherals.
• Power Supply  Specified supply range of 2.375 V to 2.625 V to match system power rails and simplify power sequencing.
• Package and Mounting  256-BGA package (supplier package: 256-FBGA, 17×17) optimized for compact board layouts; surface-mount mounting type.
• Operating Range  Commercial grade operation from 0°C to 85°C for typical commercial-environment deployments.
• Environmental Compliance  RoHS compliant for reduced hazardous substance content in manufacturing.

Typical Applications

• Commercial Embedded Systems  Implements custom digital functions and control logic in general-purpose commercial electronics where reprogrammability is required.
• Prototyping and Proof-of-Concept  Used for hardware validation and iterative design due to its reconfigurable logic and on-chip memory.
• I/O-Intensive Interfaces  Acts as an interface bridge or protocol glue for systems requiring numerous external connections and signal routing.

Unique Advantages

• Balanced Logic and Gate Count: 5,292 logic elements and ~200,000 gates deliver a practical midpoint between small CPLDs and larger FPGAs for many commercial designs.
• Generous I/O Capability: 176 I/O pins enable direct connection to multiple peripherals and buses, reducing the need for external I/O expanders.
• Compact, Production-Ready Package: 256-BGA (256-FBGA, 17×17) combines dense routing with a surface-mount form factor suitable for compact PCBs.
• Clear Power and Thermal Specs: Defined supply range and commercial temperature rating simplify system integration and validation.
• RoHS Compliance: Environmentally compliant for modern manufacturing requirements.

Why Choose XC2S200-6FG256C?

The XC2S200-6FG256C offers a practical, reprogrammable solution for commercial designs that require moderate logic density, substantial I/O, and embedded memory in a compact BGA package. Its defined electrical and thermal specifications make it straightforward to integrate into production assemblies.

This part is well suited to design teams seeking a reliable, commercially graded FPGA for prototyping, interface logic, and embedded system functions where reconfigurability and board-level density are priorities.

Request a quote or submit a product inquiry to receive pricing, availability, and ordering information for the XC2S200-6FG256C and to discuss how it can fit into your next design.