XC2S200-6FGG456C

The XC2S200-6FGG456C is a Spartan®-II Field Programmable Gate Array (FPGA) supplied in a 456-BBGA package. It integrates up to 5,292 logic elements with approximately 57,344 bits of on-chip RAM and offers 284 user I/O pins, making it suitable for designs that require moderate logic density and significant I/O connectivity.

Engineered for surface-mount assembly, this commercial-grade FPGA operates from a core voltage range of 2.375 V to 2.625 V and is specified for operation from 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic — 5,292 logic elements provide the programmable fabric for implementing custom digital logic functions and glue logic.
• Embedded Memory — Approximately 57,344 bits of on-chip RAM support buffering, small FIFOs, and local storage for logic functions.
• I/O Capacity — 284 user I/O pins enable broad external connectivity for peripherals, interfaces, and board-level signals.
• Gate Equivalent — Approximately 200,000 gates to help quantify device scale for system partitioning and capacity planning.
• Power Supply — Core voltage range of 2.375 V to 2.625 V to match system power rails and design constraints.
• Package and Mounting — 456-ball BGA package (supplier device package: 456-FBGA, 23×23) designed for surface-mount PCB assembly.
• Operating Range — Commercial-grade temperature rating of 0 °C to 85 °C for standard ambient environments.
• Regulatory Compliance — RoHS compliant to support lead-free assembly processes.

Typical Applications

• Custom Digital Logic — Implement medium-complexity custom logic and state machines using the device’s 5,292 logic elements and embedded RAM.
• I/O Expansion and Glue Logic — Use the 284 I/O pins to aggregate and interface multiple peripherals or to provide board-level signal control.
• Prototyping and System Integration — Suitable for prototyping and integration tasks where on-chip RAM and moderate gate count are required for validation and system proof-of-concept.

Unique Advantages

• Well-defined logic capacity: 5,292 logic elements and ~200,000 gates provide clear sizing for design partitioning and resource planning.
• Significant on-chip memory: Approximately 57,344 bits of embedded RAM reduces reliance on external memory for small buffers and FIFOs.
• High I/O count: 284 user I/O pins support complex board-level connectivity and multiple peripheral interfaces.
• Compact BGA footprint: 456-BBGA (456-FBGA, 23×23) allows dense routing and space-efficient PCB layouts in surface-mount designs.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial applications.
• RoHS compliant: Enables lead-free assembly processes and easier compliance with environmental regulations.

Why Choose XC2S200-6FGG456C?

The XC2S200-6FGG456C combines a balanced set of logic resources, embedded memory, and a high I/O count in a compact 456-BBGA package, delivering a practical solution for designs that require moderate programmable logic and extensive board-level connectivity. Its defined electrical and thermal specifications (core voltage 2.375 V–2.625 V; 0 °C–85 °C) make it straightforward to integrate into commercial electronic products.

This FPGA is well suited to engineers and teams looking for a reproducible, RoHS-compliant programmable device with clear resource metrics for capacity planning, prototyping, and system integration. Its package and surface-mount mounting type support modern PCB assembly workflows and compact system designs.

Request a quote or submit an inquiry to receive pricing and availability information for XC2S200-6FGG456C and to discuss how it fits your next design.