XC2S200-6FGG256C

The XC2S200-6FGG256C is a Spartan®-II field programmable gate array (FPGA) from AMD designed for commercial electronic systems requiring reconfigurable digital logic. It provides a balance of logic capacity, embedded memory, and I/O resources in a compact 256-BGA package for surface-mount assembly.

Key on-chip resources include approximately 5,292 logic elements and about 57,344 bits of embedded memory, with 176 user I/O pins and an estimated 200,000 equivalent gates. The device operates from a 2.375 V to 2.625 V core supply and supports commercial temperature ranges for mainstream applications.

Key Features

• Core Logic  Approximately 5,292 logic elements enabling implementation of custom digital logic and control functions.
• Embedded Memory  Approximately 57,344 bits of on-chip RAM for buffering, lookup tables, and small data stores.
• I/O Capacity  176 user I/O pins to interface with external peripherals, sensors, and bus systems.
• Gate Equivalent  Around 200,000 gates of logic capacity for mid-range system integration.
• Package and Mounting  256-BGA (supplier device package: 256-FBGA 17×17) in a surface-mount form factor for compact board layouts.
• Power  Core voltage supply range of 2.375 V to 2.625 V for proper power sequencing and design planning.
• Temperature and Grade  Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• Custom Digital Logic and Prototyping  Implement and iterate bespoke digital designs using programmable logic and on-chip memory.
• Embedded Control  Integrate control and glue-logic functions where moderate logic density and multiple I/O are required.
• I/O Expansion and Interface Bridging  Use the device’s 176 I/O pins to consolidate and manage multiple peripheral interfaces on a single package.

Unique Advantages

• Balanced Logic and Memory  Combines approximately 5,292 logic elements with about 57,344 bits of embedded RAM to support both combinational and small-state designs.
• High I/O Count  176 I/O pins provide flexibility for connecting a variety of external devices without additional interface chips.
• Compact Surface-Mount Package  256-BGA (17×17 FBGA) supports dense board layouts and automated assembly processes.
• Commercial-Grade, RoHS Compliant  Designed for standard commercial environments with RoHS compliance for regulatory alignment.
• Predictable Power Envelope  Defined core supply range (2.375 V to 2.625 V) aids in power system design and supply selection.

Why Choose XC2S200-6FGG256C?

The XC2S200-6FGG256C targets designs that require a mid-range FPGA with a practical mix of logic capacity, on-chip memory, and abundant I/O in a compact BGA package. Its specifications suit commercial embedded systems where reconfigurable logic, prototyping, or consolidation of peripheral interfaces is needed.

Backed by AMD’s Spartan®-II family, the device provides a predictable platform for engineers seeking scalable, reprogrammable logic with clear electrical and thermal parameters for integration into production and development boards.

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