XC2S50-6FG256C

The XC2S50-6FG256C is an AMD Spartan®-II field programmable gate array supplied in a 256-ball BGA package. It provides a balance of configurable logic and I/O density for commercial-grade programmable logic designs.

Key device attributes include 1,728 logic elements, 32,768 bits of on-chip RAM, 176 user I/Os and an estimated 50,000 gates, with a 2.375–2.625 V supply range and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  Approximately 1,728 logic elements supporting up to 50,000 gates of user logic for medium-complexity digital functions.
• Embedded Memory  32,768 total RAM bits of on-chip memory for buffering, state retention and small lookup tables.
• I/O Capacity  176 user I/O pins to support multiple external interfaces and peripheral connections.
• Package & Mounting  256-ball FBGA (17 × 17) in a surface-mount package for compact board integration.
• Power  Single-supply operation in the range 2.375 V to 2.625 V to match common FPGA supply rails.
• Temperature & Grade  Commercial-grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for lead-free, environmentally conscious designs.

Typical Applications

• Commercial Embedded Systems  Configurable logic and I/O resources can implement control, interface and glue logic in a range of commercial electronic products.
• Prototyping and Evaluation  Moderate logic density and on-chip RAM make the device suitable for hardware prototyping and proof-of-concept designs.
• Peripheral and Interface Bridging  High I/O count allows the FPGA to serve as a flexible interface hub between controllers, sensors and external peripherals.

Unique Advantages

• Balanced Logic Density:  Around 1,728 logic elements and an estimated 50,000 gates provide sufficient capacity for medium-complexity designs without excess cost or footprint.
• Integrated On-Chip Memory:  32,768 bits of embedded RAM reduce the need for external buffering in many common functions.
• High I/O Count in a Compact Package:  176 I/Os in a 256-FBGA (17 × 17) package help minimize board area while maintaining connectivity.
• Commercial Temperature Rating:  0 °C to 85 °C operation aligns with general commercial product requirements.
• RoHS Compliant:  Meets environmental regulations for lead-free assembly and materials.
• Narrow Supply Window:  2.375–2.625 V supply range simplifies power rail design when matching common FPGA supply requirements.

Why Choose XC2S50-6FG256C?

The XC2S50-6FG256C positions itself as a practical, commercially graded Spartan-II FPGA option for designers needing moderate logic capacity, a substantial number of I/Os and on-chip RAM in a compact BGA package. Its combination of approximately 1,728 logic elements, 32,768 bits of RAM and 176 I/Os makes it suitable for a wide range of commercial embedded and prototyping applications.

For engineering teams focused on compact board layouts, predictable supply requirements and RoHS-compliant components, the XC2S50-6FG256C offers a straightforward integration path with clear, verifiable specifications.

Request a quote or submit a pricing inquiry for the XC2S50-6FG256C to receive current availability and commercial terms.