XC2S50-6FGG256C

The XC2S50-6FGG256C is a Spartan®-II field programmable gate array (FPGA) IC from AMD packaged in a 256‑ball BGA. It delivers programmable logic capacity with 1,728 logic elements, approximately 32,768 bits of embedded RAM and up to 176 user I/O in a compact surface‑mount package.

Designed for commercial applications that require configurable digital logic, the device combines on‑chip memory, a moderate gate count and a compact 256‑FBGA (17×17) footprint with a supply voltage range of 2.375 V to 2.625 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  1,728 logic elements supporting a total device gate count of approximately 50,000 gates for implementing custom digital functions.
• Programmable Logic Blocks  384 CLB resources (as identified in device data) to structure user logic across the fabric.
• Embedded Memory  Approximately 32,768 bits of on‑chip RAM for temporary storage, FIFOs, and small buffering tasks without external memory.
• I/O  Up to 176 user I/O pins to interface with peripherals, sensors, and system busses within a single FPGA package.
• Package and Mounting  256‑FBGA (17×17) surface‑mount package for dense board integration and reliable soldered connections.
• Power  Nominal supply operation across 2.375 V to 2.625 V to match system power domains.
• Environmental & Grade  Commercial grade device with RoHS compliance and an operating temperature range of 0 °C to 85 °C.

Typical Applications

• Custom digital logic and glue‑logic  Implement user-defined state machines, protocol adapters and interface glue with up to 1,728 logic elements.
• Embedded system I/O expansion  Add flexible parallel and serial I/O to microcontroller or processor systems using the device’s 176 I/O pins.
• On‑chip buffering and small memory functions  Use the approximately 32,768 bits of embedded RAM for FIFOs, small frame buffers or temporary data storage without external components.
• Compact board designs  Deploy in space‑constrained PCBs where a 256‑FBGA (17×17) surface‑mount package supports dense integration.

Unique Advantages

• Balanced logic and memory  Combines 1,728 logic elements with embedded RAM to support mixed control and data buffering tasks on a single device.
• High I/O count in a compact package  176 user I/O pins in a 256‑FBGA enable rich external connectivity while conserving PCB area.
• Reduced external BOM  On‑chip RAM and substantial gate capacity reduce the need for discrete memories and glue components, simplifying system bill of materials.
• Commercial temperature range  Rated to operate from 0 °C to 85 °C to meet standard commercial deployment requirements.
• RoHS compliant  Meets regulatory requirements for lead‑free assembly in RoHS‑restricted applications.

Why Choose XC2S50-6FGG256C?

The XC2S50-6FGG256C positions itself as a compact, configurable logic solution for commercial embedded designs that need a balance of logic capacity, on‑chip memory and a high I/O count. Its 256‑FBGA package and surface‑mount mounting make it suitable for space‑efficient boards while the device’s supply and temperature specifications align with common system power domains and commercial operating environments.

Choose this Spartan®-II FPGA when your design requires flexible, field‑programmable logic with integrated RAM and extensive I/O in a RoHS‑compliant, commercial‑grade package that simplifies board integration and reduces external component count.

Request a quote or submit a parts inquiry to check availability and get pricing for the XC2S50-6FGG256C. Our team can assist with lead times and volume options to support your design cycle.