XC3130-4PC68C

The XC3130-4PC68C is an AMD XC3100 series Field Programmable Gate Array (FPGA) in a 68‑lead LCC (J‑Lead) package. It provides a compact, commercial‑grade programmable logic solution with 100 logic elements, on‑chip RAM and a 58‑pin I/O complement for control and interfacing tasks.

Designed for 5 V systems, the device operates from 4.75 V to 5.25 V and across a commercial temperature range (0 °C to 85 °C). Its surface‑mount 68‑lead package and RoHS compliance make it suitable for standard commercial electronic assemblies.

Key Features

• Logic Capacity — 100 logic elements (100 logic cells) and approximately 2,000 gates for implementing custom combinational and sequential logic.
• Embedded Memory — 22,176 bits of on‑chip RAM to store configuration data, small buffers, or working state directly in the FPGA fabric.
• I/O Density — 58 device I/Os allow multiple peripheral and bus connections without external I/O expanders.
• Power — Single supply operation from 4.75 V to 5.25 V, compatible with standard 5 V digital systems.
• Package and Mounting — 68‑lead LCC (J‑Lead) package; supplier device package listed as 68‑PLCC (24.23 × 24.23 mm) and intended for surface‑mount assembly.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory — RoHS compliant for lead‑free assembly processes.

Unique Advantages

• Small, self‑contained FPGA: 100 logic elements and on‑chip RAM provide programmable functionality in a compact footprint for space‑constrained designs.
• Generous I/O count for its class: 58 I/Os let you connect multiple peripherals or buses directly to the device, simplifying PCB design and reducing external components.
• Standard 5 V compatibility: Operates on a 4.75 V to 5.25 V supply, easing integration into existing 5 V logic systems.
• Commercial temperature support: Rated 0 °C to 85 °C to match typical consumer and commercial electronics environments.
• RoHS compliance: Meets lead‑free assembly requirements for modern manufacturing processes.
• Surface‑mount PLCC/LCC package: The 68‑lead PLCC/LCC package (24.23 × 24.23 mm supplier footprint) supports automated assembly and a compact board layout.

Why Choose XC3130-4PC68C?

The XC3130-4PC68C is positioned as a compact, commercial‑grade FPGA option for designs that require moderate logic capacity, embedded RAM, and a substantial I/O complement within a small surface‑mount PLCC/LCC package. Its 5 V supply compatibility and RoHS compliance make it suitable for integration into standard commercial electronic products and production flows.

Choose this device when you need a reliable, small FPGA fabric with on‑chip RAM and flexible I/O for functions such as glue logic, protocol bridging, simple state machines, or custom peripheral control while maintaining a compact board footprint.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the XC3130-4PC68C. Our team can provide lead time and ordering details to support your design and production timelines.