XC3130-4PQ100I
| Part Description |
XC3100 Field Programmable Gate Array (FPGA) IC 80 22176 100 100-BQFP |
|---|---|
| Quantity | 920 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-PQFP (20x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-BQFP | Number of I/O | 80 | Voltage | 4.5 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 100 | Number of Logic Elements/Cells | 100 | ||
| Number of Gates | 2000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 22176 |
Overview of XC3130-4PQ100I – XC3100 Field Programmable Gate Array (FPGA) IC 80 22176 100 100-BQFP
The XC3130-4PQ100I is an AMD XC3100-series field programmable gate array (FPGA) supplied in a 100-pin BQFP package. It provides 100 logic elements (cells), approximately 22,176 bits of embedded RAM, and 80 user I/O pins for programmable digital logic integration.
Designed for industrial-grade applications, the device supports a 4.5 V to 5.5 V supply range and an operating temperature range of −40 °C to 100 °C, making it suitable for embedded systems that require on-chip logic, memory, and multiple I/O in a surface-mount package.
Key Features
- Logic Capacity 100 logic elements (cells) provide basic programmable logic resources for glue logic, control functions, and simple state machines.
- Embedded Memory Approximately 22,176 bits of on-chip RAM for local storage, buffering, and small lookup-table requirements.
- I/O Resources 80 user I/O pins support interfacing to external devices and peripherals in compact designs.
- Gate Count Approximately 2,000 gates for overall device density and logic mapping considerations.
- Power Operates from a 4.5 V to 5.5 V supply, compatible with standard 5 V digital systems.
- Package & Mounting 100-BQFP (100-pin PQFP, 20×14) in a surface-mount configuration for PCB assembly and space-constrained layouts.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation to meet industrial environmental requirements.
- Regulatory RoHS compliant for lead-free manufacturing and regulatory alignment.
Typical Applications
- Industrial Control Use the XC3130-4PQ100I for compact control logic and interfacing in industrial equipment, leveraging its industrial temperature rating and 80 I/O lines.
- Embedded System Glue Logic Implement bus interfacing, protocol translation, and small-state machines where 100 logic elements and on-chip RAM can consolidate discrete components.
- Sensor and Peripheral Aggregation Aggregate and preprocess signals from multiple sensors or peripherals using the available I/O and embedded memory for buffering.
Unique Advantages
- Industrial-grade temperature support: The −40 °C to 100 °C operating range enables deployment in demanding environments without additional thermal qualification.
- On-chip memory capacity: Approximately 22,176 bits of embedded RAM reduce the need for external memory in small buffering or lookup-table applications.
- Compact, surface-mount package: The 100-BQFP surface-mount package (100-PQFP, 20×14) simplifies PCB layout while providing abundant I/O for its class.
- 5 V logic compatibility: A 4.5 V to 5.5 V supply window ensures straightforward integration with standard 5 V digital systems.
- RoHS compliant: Meets lead-free manufacturing requirements for modern production environments.
Why Choose XC3130-4PQ100I?
The XC3130-4PQ100I is positioned for designers needing a compact, industrial-grade FPGA with modest logic density, on-chip memory, and a high count of I/O in a surface-mount BQFP package. Its supply voltage range and temperature rating make it suitable for embedded control, interfacing, and signal aggregation tasks where robustness and integration matter.
This device is a practical choice for engineering teams aiming to reduce board-level component count while maintaining predictable electrical and environmental specifications. Its combination of logic elements, embedded RAM, and I/O density delivers a balanced platform for small to medium complexity programmable logic tasks.
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