XC4005E-3PG156C

The XC4005E-3PG156C is a commercial-grade Field Programmable Gate Array (FPGA) from AMD, offered in a 156-pin BCPGA package. It provides a modest logic capacity with integrated on-chip RAM and a substantial I/O count, designed for commercial applications that require programmable logic in a through-hole package.

With support for a 4.75 V to 5.25 V supply and an operating range of 0 °C to 85 °C, this device targets commercial embedded designs and development platforms that need flexible interfacing and reconfigurable logic resources.

Key Features

• Logic Capacity — 466 logic elements providing configurable logic resources for glue logic, state machines, and custom digital functions.
• Embedded Memory — 6,272 bits of on-chip RAM to support small data buffers, lookup tables, and temporary storage.
• I/O Count — 112 general-purpose I/O pins to support multiple interfaces and external peripherals.
• Gate Equivalent — Approximately 5,000 gates, indicating the device's overall combinational and sequential resource scale.
• Power — Single-supply operation from 4.75 V to 5.25 V for designs targeting standard 5 V systems.
• Package & Mounting — 156-BCPGA (156-CPGA) package, supplier dimensions 42.16 × 42.16 mm, supplied in a through-hole mounting style for board-level prototyping and ease of handling.
• Commercial Grade Temperature Range — Rated for 0 °C to 85 °C operation suitable for commercial environments.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, protocol translation, or peripheral aggregation where a commercial-grade FPGA is appropriate.
• Prototyping and Development — Through-hole 156-BCPGA package and accessible I/O make the device suitable for evaluation boards and prototype designs.
• Interface and Glue Logic — Use the device to implement custom interfacing, signal routing, or timing adjustments between components using its I/O and logic resources.

Unique Advantages

• Compact Logic Footprint: 466 logic elements and ~5,000 gates provide sufficient capacity for small to medium custom logic blocks without excess complexity.
• On-Chip Memory: 6,272 bits of embedded RAM reduce the need for external buffering in applications with modest memory requirements.
• High I/O Count: 112 I/O pins allow direct connection to multiple peripherals and interfaces, simplifying board routing and design.
• Standard 5 V Compatibility: Operates from 4.75 V to 5.25 V, simplifying integration into legacy or 5 V-centric systems.
• Prototyping-Friendly Package: Through-hole 156-BCPGA packaging and clear dimensional specification (42.16 × 42.16 mm) facilitate handling and board-level testing.
• RoHS Compliant: Designed to meet environmental compliance requirements for modern assemblies.

Why Choose XC4005E-3PG156C?

The XC4005E-3PG156C positions itself as a practical, commercial-grade FPGA option for designs that require flexible programmable logic, a generous I/O count, and on-chip RAM in a through-hole BCPGA package. Its specification set—466 logic elements, 6,272 bits of RAM, 112 I/Os, and compatibility with a 5 V supply—makes it well suited for commercial embedded applications, prototyping, and interface logic tasks.

Manufactured by AMD and supplied in a 156-CPGA footprint, this device offers a straightforward integration path for designers seeking a reconfigurable solution with clear thermal and electrical limits and RoHS compliance.

If you would like pricing, availability, or to request a formal quote for the XC4005E-3PG156C, please submit a quote request or contact sales to initiate procurement and support conversations.