XC4005XL-3PQ160I

The XC4005XL-3PQ160I is an AMD field programmable gate array (FPGA) designed for industrial applications that require a compact, reconfigurable logic solution. It integrates 466 logic elements, approximately 6,272 bits of on-chip RAM, and 112 general-purpose I/O pins in a 160-pin QFP package.

This device operates from a 3.0 V to 3.6 V supply and supports an industrial temperature range of −40 °C to 100 °C, making it suitable for embedded control and interfacing roles where robustness and flexible logic density are required.

Key Features

• Core Logic 466 logic elements (logic cells) providing configurable combinational and sequential logic capacity for glue logic, state machines, and moderate-density implementations.
• Embedded Memory 6,272 bits of on-chip RAM for small data buffers, FIFOs, and state storage.
• I/O Count 112 general-purpose I/O pins to support multiple parallel interfaces and board-level connectivity.
• Package Options 160‑BQFP package; supplier device package listed as 160‑PQFP (28×28), suitable for surface-mount assembly.
• Power Single-supply operation from 3.0 V to 3.6 V simplifies power rail design in 3.3 V systems.
• Temperature and Grade Industrial-grade device rated for −40 °C to 100 °C operating temperature for use in demanding environments.
• Mounting Surface-mount package for compatibility with standard PCB assembly processes.
• Regulatory RoHS compliant for use in lead-free manufacturing environments.

Typical Applications

• Embedded Control and Glue Logic Implement control sequencing, protocol bridging, and board-level glue logic using the device’s logic elements and abundant I/O.
• Industrial Instrumentation Fit-for-purpose FPGA resources and industrial temperature rating make it suitable for sensor interfacing, simple signal processing, and system coordination functions.
• Prototyping and Development Compact logic and memory resources support proof-of-concept designs and small-scale custom logic implementations.

Unique Advantages

• Compact, reconfigurable logic: 466 logic elements provide flexible implementation of custom digital functions without discrete ASIC development.
• Ample I/O for integration: 112 I/O pins enable direct connection to multiple peripherals and parallel interfaces, reducing external glue requirements.
• Industrial robustness: Rated for −40 °C to 100 °C, suitable for systems requiring extended temperature performance.
• Standard 3.3 V supply compatibility: Operates from 3.0 V to 3.6 V to align with common 3.3 V system architectures.
• Surface-mount package: 160‑pin QFP form factor supports compact PCB layouts and standard SMT assembly.
• RoHS compliant: Supports lead-free manufacturing and regulatory requirements for many production environments.

Why Choose XC4005XL-3PQ160I?

The XC4005XL-3PQ160I offers a balanced combination of logic density, I/O capacity, and on-chip memory in a single industrial-grade FPGA package. It is well suited to designers needing a reprogrammable solution for embedded control, interface logic, and small signal processing tasks within 3.3 V systems.

With a proven package format and RoHS compliance, this device provides a practical option for projects that require modest programmable logic, reliable operation across a wide temperature range, and straightforward integration into surface-mount assemblies.

Request a quote or submit your project requirements to receive pricing and availability information for the XC4005XL-3PQ160I.